SAM19 SM8550 SM8650 CPU RAM PM8550BH PM8550VE 77098B WCN7851 SDR875 58080 SDR753 BGA Reballing Stencil For Samsung S23 S24 ULTRA

SAM19 SM8550 SM8650 CPU RAM PM8550BH PM8550VE 77098B WCN7851 SDR875 58080 SDR753 BGA Reballing Stencil For Samsung S23 S24 ULTRA

It looks like you are diving deep into the hardware architecture of the Samsung Galaxy S23 and S24 Ultra series. This list covers the core chipset, power management, and RF (radio frequency) components that make up the “brain” and “nervous system” of these flagship devices.

Since you’re looking for a reballing stencil or repair guide, here is the breakdown of what each of these components actually does.

Samsung S23 & S24 Ultra Chipset Specifications

Component Code	Component Type	Associated Device(s)	Function / Description
SM8550	CPU (SoC)	Galaxy S23 Ultra	Snapdragon 8 Gen 2: The main processor.
SM8650	CPU (SoC)	Galaxy S24 Ultra	Snapdragon 8 Gen 3: The latest high-performance processor.
RAM	LPDDR5X	S23 / S24 Ultra	High-speed memory, often “sandwiched” (PoP) on top of the CPU.
PM8550BH	Power IC (PMIC)	S23 / S24 Series	Main power management, specifically for battery charging and system rails.
PM8550VE	Power IC (PMIC)	S23 / S24 Series	Secondary power management for specific voltage regulation.
77098B	Power Amplifier	S24 Ultra	High-band power amplifier for 5G/LTE signals.
WCN7851	Connectivity IC	S24 Ultra	Wi-Fi 7 & Bluetooth 5.4 combo chip.
SDR875	RF Transceiver	S23 Ultra	Handles the conversion of radio waves to digital signals (5G).
SDR753	RF Transceiver	S24 Ultra	The updated RF transceiver for the S24 series.
58080	RF Module	S23 / S24 Series	Front-end module for signal filtering and switching.

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Reballing & Repair Context

If you are using a “SAM19” stencil, it is designed to be a “multi-purpose” or “AMAOE” style plate that aligns specifically with the BGA (Ball Grid Array) patterns of these chips.

• BGA Pitch: These chips use extremely fine pitches (often 0.3mm to 0.4mm).

• Stencil Material: High-quality stencils for these models are usually “Black Steel” or “Japanese Steel” to prevent warping under the high heat required for lead-free solder.

• The “Sandwich” Challenge: Remember that the RAM is often layered directly on top of the SM8550/SM8650. Reballing requires precise heat control to avoid damaging the CPU while removing the RAM.

Key Differences for Technicians

• S23 Ultra (SM8550): Uses the SDR875 transceiver. If you’re seeing signal issues, this is your primary target.

• S24 Ultra (SM8650): Moves to the SDR753. Note that the power management configuration (PM8550 series) is largely shared between the two, making parts of the stencil interchangeable.