Amaoe U-MTK3 BGA Reballing Stencil Tin for MTK CPU MT6625LN MT6763V MT6757V MT6739V MT6580A EMMC EMCP UFS BGA254 BGA162 Stencil

Amaoe U-MTK3 BGA Reballing Stencil Tin for MTK CPU MT6625LN MT6763V MT6757V MT6739V MT6580A EMMC EMCP UFS BGA254 BGA162 Stencil

The Amaoe U-MTK3 is a high-precision, universal-style reballing stencil specifically designed for MediaTek (MTK) chipsets commonly found in mid-range and budget smartphones. It is known for its “square hole” design, which helps prevent the solder balls from getting stuck.

Amaoe U-MTK3 Stencil Specifications

Feature	Specification
Brand	Amaoe
Model	U-MTK3 (MTK Series)
Material	High-grade Japanese Steel (Heat-resistant)
Thickness	0.12mm (Standard for BGA precision)
Hole Type	Square Hole (Anti-sticking design)
Application	MTK CPU, EMMC, EMCP, and UFS Reballing

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Supported Chipsets & BGA Packages

This stencil is a “multi-in-one” solution. Below are the primary components it is designed to fit:

Component Type	Model / Package Supported
MTK CPUs	MT6625LN, MT6763V, MT6757V, MT6739V, MT6580A
Memory / Storage	EMMC, EMCP, UFS
BGA Packages	BGA254, BGA162, BGA153, BGA186, BGA221

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Key Usage Tips

• Heat Control: While these stencils are heat-resistant, it is best to use a specialized BGA Reballing Paste and heat evenly at approximately 300°C – 320°C to prevent warping.

• Cleaning: Use 99% Isopropyl Alcohol (IPA) to clean the stencil after every use to ensure the square holes remain unobstructed for the next job.

• Alignment: Because this is a multi-pattern stencil, use high-temperature Kapton tape to cover nearby holes you aren’t using to avoid accidental solder bridges.