Amaoe U-MTU4 MTK BGA Reballing Stencil For MT6582V MT6763V MT6835V MT6878V MT6895Z MT6833V MT6779V Dimensity 1100 1200 9000 8100

Amaoe U-MTU4 MTK BGA Reballing Stencil For MT6582V MT6763V MT6835V MT6878V MT6895Z MT6833V MT6779V Dimensity 1100 1200 9000 8100

The Amaoe U-MTU4 is a high-precision BGA reballing stencil specifically designed for the MediaTek (MTK) ecosystem. It covers a broad range of chipsets, from legacy processors to high-end Dimensity series units.

Amaoe U-MTU4 Technical Specifications

Feature	Details
Brand	Amaoe
Model	U-MTU4 (MTK Series)
Material	High-grade Japanese Stainless Steel
Thickness	Approximately 0.12mm (Ultra-thin for precision)
Hole Type	Square holes with rounded corners (prevents solder paste sticking)
Heat Resistance	High thermal stability; resists warping during direct heating

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Supported Chipsets & Models

This stencil is a “multi-purpose” plate for MTK technicians. Below are the primary ICs it supports:

IC Category	Supported Model Numbers
Dimensity Series	Dimensity 9000, 8100, 1200, 1100
MT68xx Series	MT6895Z, MT6878V, MT6835V, MT6833V
MT67xx Series	MT6779V (Helio P90), MT6763V (Helio P23)
Legacy MTK	MT6582V

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Key Features for Technicians

• Anti-Bulging Design: The stencil is engineered to remain flat even when under the heat of a hot air gun, ensuring uniform solder ball formation.

• Laser-Cut Precision: Each CNC-machined hole is slightly tapered to allow the solder balls to release easily once cooled.

• High Alignment Accuracy: Specifically mapped for the pinouts of the Dimensity 9000 and 8100, which have high-density ball grids.

Note: Always ensure the IC is thoroughly cleaned of old solder and flux before aligning the stencil to prevent misalignment or bridging.