Amaoe U-QSU6 BGA Reballing Stencil For Qualcomm Snapdragon 8 Ultra SM8750 8S Gen3 SM8635 7S Gen3 SM7635 4Gen2 SM4450 7Gen3 SM7550

Amaoe U-QSU6 BGA Reballing Stencil For Qualcomm Snapdragon 8 Ultra SM8750 8S Gen3 SM8635 7S Gen3 SM7635 4Gen2 SM4450 7Gen3 SM7550

The Amaoe U-QSU6 is a high-precision BGA (Ball Grid Array) reballing stencil specifically engineered for the latest generation of Qualcomm Snapdragon processors. This stencil is a “multi-model” or “concentration” plate, meaning it features multiple cutout patterns on a single sheet of steel to support various high-end CPUs.

Amaoe U-QSU6 Technical Specifications

Feature	Specification
Model	Amaoe U-QSU6 (Qualcomm CPU Series)
Material	High-grade Japanese Stainless Steel (Heat-resistant)
Stencil Thickness	0.12 mm
Hole Design	Precision laser-cut square/round apertures
Hole Alignment	45-degree angle pattern (improves solder flow)
Support Type	Direct-heat (designed to resist warping during reflow)
Compatible Brands	Xiaomi, Samsung, Vivo, Oppo, and other flagship Android devices

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Supported Qualcomm Chipsets

The U-QSU6 is one of the most comprehensive stencils for the 2024-2025 chip cycle. It covers the following Integrated Circuits (ICs):

• Snapdragon 8 Ultra: SM8750

• Snapdragon 8s Gen 3: SM8635

• Snapdragon 8 Gen 3: SM8650

• Snapdragon 7 Gen 3: SM7550

• Snapdragon 7s Gen 3: SM7635

• Snapdragon 4 Gen 2: SM4450

• Snapdragon 6 Gen 1 / 7s Gen 2: SM6450 / SM7435

Key Features

• Anti-Warping: Built to withstand the high temperatures required for lead-free solder paste without losing its flat profile.

• Precision Pitch: The 0.12mm thickness is the industry standard for mobile CPUs, ensuring that solder balls are large enough for a solid connection but small enough to prevent bridging.

• Easy Demolding: The laser-cut holes are slightly tapered, allowing the stencil to be lifted away from the solder paste without smearing the “bricks.”

Technician’s Note: When using the U-QSU6, it is recommended to use high-quality 183°C or 138°C solder paste depending on the specific component’s thermal sensitivity. Always clean the stencil with PCB cleaner or ultrasonic fluid immediately after use to prevent solder buildup in the micro-apertures.