One Plus 9pro Motherboard Middle Layer BGA Reballing Stencil

One Plus 9pro Motherboard Middle Layer BGA Reballing Stencil

For the OnePlus 9 Pro, technicians typically use a specialized middle-frame BGA stencil (often from manufacturers like Amaoe or Mijing) to handle the “sandwich” motherboard design common in modern flagship devices.

Below are the technical specifications for the OnePlus 9 Pro Motherboard Middle Layer Reballing Stencil:

OnePlus 9 Pro Middle Layer Stencil Specifications

Feature	Specification
Compatible Model	OnePlus 9 Pro (1+9P / LE2121 / LE2123 / LE2125)
Stencil Type	Middle Frame / Middle Layer BGA Reballing Stencil
Material	High-grade Japanese Stainless Steel (Non-deforming)
Standard Thickness	0.12 mm (Standard) or 0.10 mm (Ultra-thin)
Aperture Design	Square holes with rounded corners (Laser-cut)
Heat Resistance	Up to 450°C (to prevent warping during reflow)
Solder Ball Pitch	~0.3 mm to 0.4 mm (model-specific pitch)
Alignment Method	Precision CNC laser-cut alignment holes for PCB pillars
Finish	Anti-stick / Smooth surface for easy paste release

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Key Features for Technicians

• Laser-Cut Precision: The holes are specifically tapered to allow solder paste to release cleanly without sticking, which is critical for the high-density pads on the Snapdragon 888 chipset and surrounding RAM.

• Thermal Stability: These stencils are designed to resist “bubbling” or bowing when heat is applied, ensuring the solder balls remain uniform across the entire middle layer.

• Layer Compatibility: Specifically designed for the interposer layer that connects the top (AP/RAM) and bottom (RF/Baseband) boards of the OnePlus 9 Pro.

Note: If you are performing a full CPU swap or re-stacking, ensure you are using a high-lead (183°C) or lead-free (217°C) solder paste depending on your equipment’s thermal profile. Most technicians prefer 183°C liquid solder paste for the middle layer to reduce the risk of thermal damage to the internal components during the joining process.