AMAOE U-QSD11 BGA Reballing Stencil for Snapdragon 6Gen1 8Gen2/3 SM6450 SM8550 8650

AMAOE U-QSD11 BGA Reballing Stencil for Snapdragon 6Gen1 8Gen2/3 SM6450 SM8550 8650

The AMAOE U-QSD11 is a high-precision BGA reballing stencil specifically engineered for the latest generation of Qualcomm Snapdragon chipsets. It is a “multipurpose” or “integrated” stencil, meaning it contains several layouts on a single sheet to cover the CPU, RAM, and supporting power/connectivity ICs for specific flagship and mid-range mobile platforms.

Full Specifications: AMAOE U-QSD11

Feature	Details
Brand	AMAOE
Model Number	U-QSD11 (Qualcomm Series)
Material	High-grade Japanese Stainless Steel (Anti-magnetic & Anti-acid)
Thickness	0.12mm (Standard precision thickness for modern mobile CPUs)
Hole Design	Precision laser-cut square-bottomed apertures (prevents solder ball sticking)
Heat Resistance	Up to 500°C (Designed for direct heating/reflow)
Primary Chipsets	Snapdragon 6 Gen 1, 8 Gen 2, 8 Gen 3, 8s Gen 3
CPU Models	SM6450, SM8550, SM8650
RAM Support	Compatible with LPDDR5/5X (RAM496 layouts)
Weight	~0.02kg – 0.03kg

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Comprehensive Compatibility List

Beyond the main CPUs, the U-QSD11 includes apertures for various peripheral chips often found on the same motherboards:

• Integrated Circuits (ICs): SM8550, SM8650, SM6450, SM7435, SM8635.

• Power & Connectivity: PM7250B, PM6450, PM6150C, PM8550BH, WCN3988, WCD9370 (Audio Codec).

• RF & Specialized ICs: SDR753, QET7100, VC7643, 58080, 77042, 77048E.

• Standard Packages: BGA200, BGA153, RAM496.

Key Performance Benefits

• Anti-Bulge Technology: The stencil is designed to remain flat under high heat, reducing the risk of “stencil pop” which causes solder bridges.

• Accurate Alignment: Features silk-screened labels and precise positioning marks tailored for the Snapdragon 8 series’ dense pinout.

• High Durability: The hardened steel allows for hundreds of reballing cycles if cleaned properly with PCB cleaner or ultrasonic baths.