₹250 Original price was: ₹250.₹139Current price is: ₹139.
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The AMAOE U-QSD11 is a high-precision BGA reballing stencil specifically engineered for the latest generation of Qualcomm Snapdragon chipsets. It is a “multipurpose” or “integrated” stencil, meaning it contains several layouts on a single sheet to cover the CPU, RAM, and supporting power/connectivity ICs for specific flagship and mid-range mobile platforms.
Beyond the main CPUs, the U-QSD11 includes apertures for various peripheral chips often found on the same motherboards:
Integrated Circuits (ICs): SM8550, SM8650, SM6450, SM7435, SM8635.
Power & Connectivity: PM7250B, PM6450, PM6150C, PM8550BH, WCN3988, WCD9370 (Audio Codec).
RF & Specialized ICs: SDR753, QET7100, VC7643, 58080, 77042, 77048E.
Standard Packages: BGA200, BGA153, RAM496.
Anti-Bulge Technology: The stencil is designed to remain flat under high heat, reducing the risk of “stencil pop” which causes solder bridges.
Accurate Alignment: Features silk-screened labels and precise positioning marks tailored for the Snapdragon 8 series’ dense pinout.
High Durability: The hardened steel allows for hundreds of reballing cycles if cleaned properly with PCB cleaner or ultrasonic baths.
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