Amaoe MI18 BGA Reballing Stencil For Xiaomi poco/C40 SOSG761 JLQ JR510 CPU SGM41542 WTR2965 VC7643 VC7916-36

Amaoe MI18 BGA Reballing Stencil For Xiaomi poco/C40 SOSG761 JLQ JR510 CPU SGM41542 WTR2965 VC7643 VC7916-36

The Amaoe MI18 is a specialized BGA reballing stencil designed specifically for the Xiaomi Poco C40 and other devices utilizing the JLQ JR510 chipset. It is known for its high-precision square-hole design and use of high-quality Japanese steel to ensure thermal stability during the soldering process.

Amaoe MI18 Technical Specifications

Feature	Details
Brand	Amaoe (Tianmu)
Model	MI-18 (Xiaomi/Poco Series)
Material	High-Grade Japanese Stainless Steel
Thickness	0.12mm
Hole Type	Square (Precision Laser-Cut)
Supported Device	Xiaomi Poco C40
Main CPU Supported	JLQ JR510
Stencil Weight	Approx. 0.01kg – 0.02kg
Features	Anti-deformation, Heat resistant, Precise alignment holes

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Supported IC & Component List

The MI18 stencil is a “multi-in-one” template that covers the primary integrated circuits found on the Poco C40 motherboard:

• CPU: SOSG761 / JLQ JR510

• Power Management (PMIC): PMJ510, SGM41542

• Radio Frequency (RF): WTR2965

• Audio/Interface: WCD9370

• Connectivity: WCN3950 (Wi-Fi/Bluetooth)

• Front-End Modules: VC7643, VC7916-36

• Memory: BGA153 (EMMC), BGA200 (RAM/Combined)

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Pro-Tips for Reballing with MI18

Note: Because the stencil is 0.12mm thick, it is optimized for “medium-temperature” solder paste (approx. 183°C).

• Alignment: Ensure the IC is perfectly centered in the square holes before applying paste; the square-hole design helps the solder balls form more uniformly than traditional round holes.

• Heat Management: To prevent warping, heat the stencil evenly. Start with your hot air gun at a distance and move in a circular motion.

• Cleaning: Use 99% Isopropyl Alcohol (IPA) to clean the stencil immediately after use to prevent solder paste from hardening in the fine apertures.