AMAOE SAM 20 BGA Reballing Stencil For Samsung A156U A156E MT6835V DIM6100+

AMAOE SAM 20 BGA Reballing Stencil For Samsung A156U A156E MT6835V DIM6100+

The AMAOE SAM 20 is a specialized, high-precision BGA reballing stencil designed for the modern Samsung A-series repair ecosystem. It is specifically engineered to handle the MediaTek Dimensity 6100+ (MT6835V) chipset architecture found in the Samsung Galaxy A15 5G (A156U/A156E) and related models.

AMAOE SAM 20 Stencil Specifications

Feature	Specification
Model Name	AMAOE SAM 20 (Samsung Series)
Supported CPU	MediaTek MT6835V (Dimensity 6100+)
Compatible Devices	Samsung Galaxy A156U, A156E (A15 5G)
Thickness	0.12 mm
Material	High-grade Japanese Stainless Steel
Hole Type	Square (Precision Laser-Cut)
Supported ICs	CPU, RAM, Power IC (MT6375P, MT6319NP), WiFi (MT6631N), RF (MT6197W)
Reballing Pitch	~0.3mm to 0.5mm (Standard for MTK BGA254/CPU)
Heat Resistance	High (Anti-warping under standard rework temperatures)

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Key Technical Features

• Ultra-Thin 0.12mm Profile: This specific thickness is the industry standard for modern smartphone CPUs, allowing for precise solder paste volume without causing bridging between the densely packed BGA pads.

• Square Hole Design: Unlike round holes, square apertures help the solder paste release more easily and cleanly when lifting the stencil, reducing “piling” or uneven ball height.

• Comprehensive IC Coverage: Beyond the main MT6835V CPU, the SAM 20 plate includes cutouts for the supporting power management ICs (PMIC) and radio frequency (RF) chips typically found on the A156 motherboard, such as:

  • MT6197W (RF Transceiver)

  • MT6377W / MT6375P (Power Management)

  • BGA254 (Universal storage/memory patterns)

• Alignment Markings: The stencil includes etched guides to help technicians align the chip quickly under a microscope, minimizing the risk of “shifting” during the tin-planting process.

Pro Tip: When using the 0.12mm stencil, it is recommended to use 183°C (Leaded) or 138°C (Low Temp) solder paste depending on your specific rework station profile to prevent board warping.