₹250 Original price was: ₹250.₹139Current price is: ₹139.
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The AMAOE SAM 20 is a specialized, high-precision BGA reballing stencil designed for the modern Samsung A-series repair ecosystem. It is specifically engineered to handle the MediaTek Dimensity 6100+ (MT6835V) chipset architecture found in the Samsung Galaxy A15 5G (A156U/A156E) and related models.
Ultra-Thin 0.12mm Profile: This specific thickness is the industry standard for modern smartphone CPUs, allowing for precise solder paste volume without causing bridging between the densely packed BGA pads.
Square Hole Design: Unlike round holes, square apertures help the solder paste release more easily and cleanly when lifting the stencil, reducing “piling” or uneven ball height.
Comprehensive IC Coverage: Beyond the main MT6835V CPU, the SAM 20 plate includes cutouts for the supporting power management ICs (PMIC) and radio frequency (RF) chips typically found on the A156 motherboard, such as:
MT6197W (RF Transceiver)
MT6377W / MT6375P (Power Management)
BGA254 (Universal storage/memory patterns)
Alignment Markings: The stencil includes etched guides to help technicians align the chip quickly under a microscope, minimizing the risk of “shifting” during the tin-planting process.
Pro Tip: When using the 0.12mm stencil, it is recommended to use 183°C (Leaded) or 138°C (Low Temp) solder paste depending on your specific rework station profile to prevent board warping.
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