Amaoe U-MTU3 BGA Reballing Stencil For MT6853V MT6873V MT6875V MT6833V MT6779V MT6771V Dimensity 720 810 800U 820 CPU

Amaoe U-MTU3 BGA Reballing Stencil For MT6853V MT6873V MT6875V MT6833V MT6779V MT6771V Dimensity 720 810 800U 820 CPU

The Amaoe U-MTU3 is a high-precision BGA reballing stencil designed for modern MediaTek (MTK) processors, specifically covering several Dimensity and Helio series chips. These processors are commonly found in mid-range 5G and high-performance 4G smartphones.

Below are the technical specifications for the primary CPUs supported by this stencil.

CPU Comparison & Specifications

Model Number	Commercial Name	Process	CPU Configuration (Octa-core)	GPU Type	Max RAM Support
MT6853V	Dimensity 720 / 800U	7nm	2x A76 (2.4GHz) + 6x A55 (2.0GHz)	Mali-G57 MC3	12GB LPDDR4X
MT6873V	Dimensity 800	7nm	4x A76 (2.0GHz) + 4x A55 (2.0GHz)	Mali-G57 MC4	16GB LPDDR4X
MT6875V	Dimensity 820	7nm	4x A76 (2.6GHz) + 4x A55 (2.0GHz)	Mali-G57 MC5	16GB LPDDR4X
MT6833V	Dimensity 700 / 810	7nm/6nm	2x A76 (2.2/2.4GHz) + 6x A55 (2.0GHz)	Mali-G57 MC2	12GB LPDDR4X
MT6779V	Helio P90	12nm	2x A75 (2.2GHz) + 6x A55 (2.0GHz)	PowerVR GM9446	8GB LPDDR4X
MT6771V	Helio P60 / P70	12nm	4x A73 (2.1GHz) + 4x A53 (2.0GHz)	Mali-G72 MP3	8GB LPDDR4X

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Stencil Technical Details

If you are using this for repair work, here are the physical properties of the Amaoe U-MTU3:

• Material: High-quality Japanese steel (High-temperature resistant to prevent warping).

• Thickness: 0.12mm (Standard for precise solder paste application).

• Hole Type: Square holes with rounded corners (Designed to prevent solder paste from sticking and ensure clean ball formation).

• Application: Used for CPU reballing, RAM reballing (on POP/stacked designs), and general IC tin planting.

Pro-Tip: MediaTek chips like the Dimensity 800 series are sensitive to heat. It is recommended to bake the chips at 100°C–110°C for 24 hours if they have been exposed to humidity before attempting the reballing process to avoid “popcorning” (internal delamination).