₹250 Original price was: ₹250.₹139Current price is: ₹139.
Please read the manual before use.
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The Amaoe U-MTU3 is a high-precision BGA reballing stencil designed for modern MediaTek (MTK) processors, specifically covering several Dimensity and Helio series chips. These processors are commonly found in mid-range 5G and high-performance 4G smartphones.
Below are the technical specifications for the primary CPUs supported by this stencil.
If you are using this for repair work, here are the physical properties of the Amaoe U-MTU3:
Material: High-quality Japanese steel (High-temperature resistant to prevent warping).
Thickness: 0.12mm (Standard for precise solder paste application).
Hole Type: Square holes with rounded corners (Designed to prevent solder paste from sticking and ensure clean ball formation).
Application: Used for CPU reballing, RAM reballing (on POP/stacked designs), and general IC tin planting.
Pro-Tip: MediaTek chips like the Dimensity 800 series are sensitive to heat. It is recommended to bake the chips at 100°C–110°C for 24 hours if they have been exposed to humidity before attempting the reballing process to avoid “popcorning” (internal delamination).
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