The Amaoe U-TENSOR Stencil is a high-precision BGA reballing stencil specifically designed for the Google Pixel 6 Pro Tensor CPU. This professional-grade stencil allows repair technicians, motherboard specialists, and electronics engineers to efficiently reball and rework the Tensor processor, ensuring accurate IC reattachment and improved device functionality. Amaoe U-TENSOR Stencil
Constructed from high-quality stainless steel, this stencil offers exceptional durability, heat resistance, and ultra-precise hole alignment, making it an essential tool for mobile phone motherboard repair, IC chip soldering, and BGA reballing work.
With its fine mesh design, stable frame, and optimized hole positioning, the Amaoe U-TENSOR Stencil ensures precise tin placement, reducing the risk of soldering errors and improving the success rate of BGA chip repairs. Whether you are reballing the Tensor CPU or repairing complex mobile circuit boards, this stencil provides the accuracy and reliability required for professional-level repairs.
Key Features of the Amaoe U-TENSOR Stencil
1. Custom-Designed for Google Pixel 6 Pro Tensor CPU
Specifically tailored for the Google Pixel 6 Pro’s Tensor CPU, ensuring a perfect fit for precise reballing.
Optimized hole alignment and tin distribution for accurate soldering.
Essential for Tensor CPU reballing, chip-level repairs, and IC rework.
2. High-Quality Stainless Steel Construction
Made from durable, heat-resistant stainless steel, preventing warping or deformation under high temperatures.
Ensures consistent and stable performance for repeated use.
Corrosion-resistant material, extending the stencil’s lifespan.
3. Ultra-Precision Laser-Cut Holes for Accurate Reballing
Features ultra-fine, laser-cut apertures for precise tin application and solder paste alignment.
Ensures even tin distribution to prevent short circuits and weak connections.
Reduces solder bridging issues, ensuring a higher success rate in reballing work.
4. Thin & Flexible Design for Perfect Alignment
The ultra-thin structure ensures a tight and secure fit over the Tensor CPU chip, making solder paste application more precise.
Provides excellent flexibility, allowing for better control during reballing.
5. High Heat Resistance for Efficient Soldering
Withstands high soldering temperatures, making it compatible with hot air rework stations and infrared heating.
Prevents stencil warping, ensuring long-term usability in professional repair environments.
6. Professional-Grade BGA Repair Tool for Technicians
Designed for smartphone motherboard repair specialists, microsoldering professionals, and BGA chip repair experts.
Suitable for IC reballing, CPU rework, and soldering applications in mobile phone repair labs and electronics workshops.
Why Choose the Amaoe U-TENSOR Stencil?
✅ Specifically Designed for Google Pixel 6 Pro Tensor CPU – Ensures perfect alignment and accurate reballing results.
✅ Ultra-Precise Laser-Cut Holes for Even Tin Application – Reduces soldering errors, bridging, and weak connections.
✅ Premium Stainless Steel for Durability & Heat Resistance – Prevents warping, corrosion, and long-term wear.
✅ Thin & Flexible for Seamless Alignment – Provides precise positioning over the IC chip, enhancing reballing accuracy.
✅ Ideal for Professional Repair Technicians – A must-have tool for BGA soldering, motherboard rework, and microsoldering tasks.
Applications of the Amaoe U-TENSOR Stencil
✔ Google Pixel 6 Pro Tensor CPU Reballing – Ensures precise tin application for IC chip repair and replacement. ✔ BGA Chip Rework & Repair – Perfect for resoldering detached or faulty IC components. ✔ Smartphone Motherboard Soldering – Ideal for fixing damaged circuits, repairing broken pads, and improving device functionality. ✔ Professional Electronics Repair & Micro Soldering – Suitable for use in repair labs, service centers, and BGA chip refurbishment.
How to Use the Amaoe U-TENSOR Stencil for Best Results?
1. Prepare the Work Area
Set up a clean, ESD-safe workspace with proper lighting and ventilation.
Use a microscope or magnifying lens for high-precision soldering work.
2. Secure the Stencil & Align the CPU
Place the Google Pixel 6 Pro Tensor CPU on a flat, heat-resistant surface.
Align the Amaoe U-TENSOR Stencil over the chip, ensuring the holes perfectly match the contact pads.
3. Apply Solder Paste or Tin Balls
Use high-quality solder paste and a squeegee to spread an even layer of tin over the stencil.
If using tin balls, carefully place them into the apertures using tweezers.
4. Heat & Reflow the Solder
Use a hot air rework station (300-350°C) to reflow the solder paste evenly.
Ensure controlled heating to prevent overheating or damaging the chip.
5. Remove the Stencil & Inspect the Solder Joints
Once the solder has solidified, carefully remove the stencil without disturbing the connections.
Inspect the reballing results under a microscope to ensure clean, even solder joints.
6. Attach the CPU to the Motherboard
After confirming perfect solder alignment, reattach the reballed Tensor CPU to the Google Pixel 6 Pro motherboard.
Secure the chip with precise heating to complete the repair.
Technical Specifications
Brand: Amaoe
Model: U-TENSOR Stencil
Compatibility: Google Pixel 6 Pro Tensor CPU
Material: High-Quality Stainless Steel
Thickness: Ultra-thin for precise solder application
Hole Type: Laser-cut apertures for accurate tin placement
Heat Resistance: High-temperature resistant, suitable for hot air and infrared rework stations
Conclusion
The Amaoe U-TENSOR Stencil for Google Pixel 6 Pro Tensor CPU is a must-have tool for professional mobile repair technicians who specialize in BGA chip reballing and IC rework. Designed with precision laser-cut holes, durable stainless steel, and high heat resistance, this stencil ensures perfect alignment and reliable soldering results.
Whether you’re reballing the Tensor CPU, repairing smartphone motherboards, or working on delicate IC chip soldering, this stencil provides exceptional accuracy and efficiency.
Upgrade your BGA reballing toolkit today with the Amaoe U-TENSOR Stencil and achieve flawless reballing results with ease!
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