LUOWEI LW-311 0.007MM Ultra Fine Silver Jump Wire for Mobile Phone Repair Flying Line
The LUOWEI LW-311 is a high-precision silver jump wire specifically engineered for micro-soldering and motherboard repair.Its ultra-fine 0.007mm diameter makes it nearly invisible to the naked eye, designed for repairing “broken lines” under CPUs, fingerprint sensors, and high-density PCB pads.
Technical Specifications
Feature
Specification
Model Number
LW-311 (0.007mm version)
Material
High-Purity Silver (Conductive Alloy)
Diameter
$0.007\text{ mm}$ (7 Microns)
Standard Length
Approx. $200\text{ meters}$
Insulation
Non-insulated (Conductive surface)
Welding Type
Direct welding (no scraping required)
Magnetic Property
Non-magnetic
Toughness
High flexibility/ductility; resistant to breakage
Storage Dimensions
$62 \times 62 \times 14.7\text{ mm}$ (Spool size)
Net Weight
Approx. $0.05\text{ kg}$
Key Performance Features
Direct Welding: Unlike traditional enameled wires, this silver wire allows for direct soldering without the need to scrape off an insulation layer, significantly speeding up micro-repair tasks.
Superior Conductivity: The silver composition offers lower resistance compared to standard copper, ensuring high signal integrity for delicate data lines (like FaceID or CPU traces).
“Hair-Thin” Precision: At $0.007\text{ mm}$, it is thinner than a human hair (which is typically $0.05\text{–}0.07\text{ mm}$), allowing it to fit between the tightest BGA pins.
High Ductility: The wire is designed to be “superplastic,” meaning it can be stretched and bent into complex shapes without snapping, which is vital for “flying line” repairs.
Common Applications
CPU Chip Repair: Bridging broken circuits under the mobile processor.
Fingerprint/Touch ID: Repairing the extremely fragile ribbon cable traces.
Motherboard Pad Repair: Restoring “dropped” or torn pads on a PCB.
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