Amaoe U-MTU5 BGA Reballing Stencil For MTK Dimensity 9400 9200 8300 Ultra 6100 CPU MT6991Z MT6989W MT6985W MT6897Z
The Amaoe U-MTU5 is a high-precision BGA reballing stencil specifically engineered for the latest generation of MediaTek (MTK) Dimensity chipsets. It is a staple tool for professional technicians performing CPU and RAM swaps or repairs on flagship Android devices.
Amaoe U-MTU5 Technical Specifications
Feature
Specification
Model
Amaoe U-MTU5 (MTK CPU Series)
Material
High-grade Japanese Stainless Steel (High-temperature resistant)
Thickness
0.12 mm (Optimized for precise solder paste volume)
Hole Design
Square holes with tapered (conical) edges to prevent bridging
The U-MTU5 is designed to be a “centralized” stencil, meaning it contains multiple precision-cut sections on a single sheet to cover various chip layouts:
Flagship Tier: Supports the Dimensity 9400 (MT6991Z) and 9200/9300 (MT6989W/MT6985W). These chips often feature a “Package on Package” (PoP) design where the RAM sits directly on top of the CPU.
Mid-to-High Tier: Supports the Dimensity 8300 Ultra (MT6897Z) and Dimensity 6100 series, common in high-performance mid-range smartphones.
Precision Alignment: Features specific corner fiducial marks and a unique cutout for the central heat spreader area to ensure the chip sits perfectly flat during the heating process.
Usage Pro-Tips
Thermal Stability: Unlike cheaper unbranded stencils, the Amaoe U-series uses a specific steel alloy that resists warping (expanding/bending) when hit with a heat gun at 330°C–350°C.
Solder Paste: For these high-density chips, it is highly recommended to use 183°C leaded or high-quality lead-free solder paste with a fine particle size (Type 4 or Type 5) to ensure uniform ball formation.
Weight
0.05 kg
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