Amaoe U-QSD12 BGA Reballing Stencil For Snapdragon 7s Gen3 6Gen1 4Gen2 SM7635 SM7550 SM6450 SM4450

Amaoe U-QSD12 BGA Reballing Stencil For Snapdragon 7s Gen3 6Gen1 4Gen2 SM7635 SM7550 SM6450 SM4450

The Amaoe U-QSD12 is a high-precision BGA reballing stencil specifically engineered for the latest generation of Qualcomm Snapdragon mid-range and entry-level chipsets. It features the signature Amaoe square-hole design, which helps prevent solder paste from sticking and ensures uniform ball formation.

Amaoe U-QSD12 Technical Specifications

Feature	Details
Brand	Amaoe (Original)
Model Number	U-QSD12 (Qualcomm Series)
Material	High-grade Japanese Stainless Steel (MS)
Thickness	0.12mm
Hole Type	Square Hole (Anti-sticking design)
Function	CPU/RAM/Power IC Reballing & Tin Planting
Weight	Approx. 0.02kg – 0.03kg
Heat Resistance	High temperature resistant (Direct heat compatible)

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Supported Chipsets & Compatibility

This stencil is a multi-function “all-in-one” plate that covers several primary processors and their supporting ICs (Power Management and RF).

Component Category	Supported Models / IC Codes
Primary CPUs	Snapdragon 7s Gen 3 (SM7635) Snapdragon 7 Gen 3 (SM7550) Snapdragon 6 Gen 1 (SM6450) Snapdragon 4 Gen 2 (SM4450)
Power ICs (PMIC)	PM4450, PM6450
RF / Baseband	SDR435
RAM / Storage	Compatible with specific LPDDR/UFS footprints used with the above CPUs

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Key Features

• Square Hole Design: Unlike traditional round holes, the square apertures allow for easier release of the solder paste, reducing the “bridge” effect or incomplete tinning.

• Accurate Alignment: Precision laser-cut to match the specific pinout of the SM7635 and SM7550, which are common in high-end mid-range devices (e.g., Redmi Note series, Poco, and Honor).

• Durability: Made from flexible yet sturdy steel that resists warping under the heat of a hot air gun (typically used at $330^\circ\text{C} – 350^\circ\text{C}$ for reballing).

Pro Tip: For best results with a 0.12mm stencil, use 183°C leaded solder paste. Ensure the IC is thoroughly cleaned with wick and IPA before securing it under the stencil.