₹250 Original price was: ₹250.₹159Current price is: ₹159.
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The Amaoe U-QSD12 is a high-precision BGA reballing stencil specifically engineered for the latest generation of Qualcomm Snapdragon mid-range and entry-level chipsets. It features the signature Amaoe square-hole design, which helps prevent solder paste from sticking and ensures uniform ball formation.
This stencil is a multi-function “all-in-one” plate that covers several primary processors and their supporting ICs (Power Management and RF).
Snapdragon 7s Gen 3 (SM7635)
Snapdragon 7 Gen 3 (SM7550)
Snapdragon 6 Gen 1 (SM6450)
Snapdragon 4 Gen 2 (SM4450)
Square Hole Design: Unlike traditional round holes, the square apertures allow for easier release of the solder paste, reducing the “bridge” effect or incomplete tinning.
Accurate Alignment: Precision laser-cut to match the specific pinout of the SM7635 and SM7550, which are common in high-end mid-range devices (e.g., Redmi Note series, Poco, and Honor).
Durability: Made from flexible yet sturdy steel that resists warping under the heat of a hot air gun (typically used at $330^\circ\text{C} – 350^\circ\text{C}$ for reballing).
Pro Tip: For best results with a 0.12mm stencil, use 183°C leaded solder paste. Ensure the IC is thoroughly cleaned with wick and IPA before securing it under the stencil.
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