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2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife

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Original price was: ₹500.Current price is: ₹199.

2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife Precision Designed for Professional Results The 2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade is an essential tool for technicians and professionals working in phone IC glue removal, chip layer lifting, and solder pad maintenance. … Continue reading 2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife

Similar products: "2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife"

-18%

2UUL DA81 Chargeable Polish Drill Pen for Phone Repair

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Original price was: ₹1,700.Current price is: ₹1,399.
-40%

2UUL DA83 Cutter for Phone Repair

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Original price was: ₹500.Current price is: ₹300.
-20%

2UUL DA84 CVT Grinder Pro Version For Phone Repair

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Original price was: ₹2,000.Current price is: ₹1,599.
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