2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife Precision Designed for Professional Results The 2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade is an essential tool for technicians and professionals working in phone IC glue removal, chip layer lifting, and solder pad maintenance. … Continue reading 2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife