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2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife

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Original price was: ₹500.Current price is: ₹199.

2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife Precision Designed for Professional Results The 2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade is an essential tool for technicians and professionals working in phone IC glue removal, chip layer lifting, and solder pad maintenance. … Continue reading 2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife

Similar products: "2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife"

-37%

RELIFE RL-033M 144 Microscope USB Light

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Original price was: ₹1,500.Current price is: ₹949.
-30%

RELIFE RL-039 BGA IC GLUE REMOVER LIQUID 20ML

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Original price was: ₹500.Current price is: ₹349.
-17%

Relife RL-056C 6-Speed Adjustment Smart Screen Glue Remover

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Original price was: ₹1,200.Current price is: ₹998.
-36%

RELIFE RL-064U Hydrogel Film Scraper for Hydrgogel Film

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Original price was: ₹200.Current price is: ₹129.
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