2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife

2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife

Precision Designed for Professional Results

The 2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade is an essential tool for technicians and professionals working in phone IC glue removal, chip layer lifting, and solder pad maintenance. Its meticulously crafted blade ensures clean, precise cuts without compromising sensitive components during repair tasks.

Built for Efficiency and Durability

With its robust and ergonomic design, this blade offers superior control and efficiency, making even the toughest underfill glue removal and separation tasks effortless. Whether you’re handling delicate phone chips, tackling solder pad adhesive residues, or lifting separation layers with precision, the 2UUL DA28 Flatcut blade is engineered to deliver exceptional results while maximizing user comfort during extended use.

Versatility for Complex Repair Challenges

The 2UUL DA28 stands out as a versatile and reliable solution for diverse repair scenarios. Its flatcut design and specialized features make it the ideal tool for separating stubborn adhesive layers on phone IC chips, lifting separation layers cleanly, or addressing intricate glue removal challenges. This blade is indispensable in any advanced technician’s toolkit, streamlining complex processes to enhance productivity and accuracy.

Invest in the 2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade to experience the perfect blend of precision, durability, and ease of use. Simplify intricate tasks and focus on delivering professional-grade repairs with confidence.