338S00105 U3500 BIG AUDIO IC FOR IPHONE 6S, 6S PLUS, 7G, 7 PLUS

Original price was: ₹240.Current price is: ₹123.

2 in stock

338S00105 U3500 BIG AUDIO IC FOR IPHONE 6S, 6S PLUS, 7G, 7 PLUS

Original price was: ₹240.Current price is: ₹123.

2 in stock

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  • User Guide

    User Guide

    Please read the manual before use.

    1. Introduction & Workspace Setup

    This section sets the foundation for a safe repair environment. Before a single tool touches a phone, the workspace must be prepared to protect both the technician and the sensitive electronics.

    • Electrostatic Discharge (ESD) Safety: Instructions on grounding yourself using an ESD wrist strap and working on an anti-static mat to prevent frying microchips with static electricity.

    • Safety Gear: Protocols for wearing safety glasses (critical when prying shattered glass) and working in a well-ventilated area (crucial for adhesive fumes and soldering smoke).

    • Lighting and Magnification: Recommendations for high-intensity desk lamps and digital microscopes or magnifying visors for viewing microscopic components.

    2. Disassembly & Opening Tools

    The most physically risky part of mobile repair is opening the device without cracking the glass screen or ripping delicate internal ribbon cables.

    • Thermal Tools (Heat Guns & Heat Pads): Instructions on setting precise temperatures (typically 80°C to 100°C) to soften heavy factory adhesives without damaging the display.

    • Suction & Leverage Tools: Proper placement of heavy-duty suction cups and screen prying fixtures to safely create an initial gap.

    • Separation Media (Plastic Picks & Spudgers): Techniques for slicing through glue lines using plastic opening picks without inserting them too deeply into the frame.

    3. Fastener & Component Manipulation

    Modern smartphones use dozens of tiny, highly specialized screws and brackets to hold internal shields in place.

    • Precision Driver Identification: A breakdown of specialized micro-bits, detailing exactly when to use Pentalobe (iPhones), Tri-point/Y-type (internal Apple shields), Torx/Torx Security (Android devices), and standard Micro-Phillips.

    • Organization Systems: Guidelines for using magnetic project mats or screw organizing trays to map out screw locations, preventing the catastrophic error of “long-screw damage.”

    • Gripping & Placer Tools: How to utilize straight and curved ESD-safe tweezers to safely disconnect fragile ZIF (Zero Insertion Force) and coaxial cable connectors.

    4. Diagnostics & Testing Equipment

    This section transitions the user from basic mechanical teardowns to logical troubleshooting when a phone won’t turn on or charge.

    • Digital Multimeter (DMM): Step-by-step instructions on setting up the meter for DC voltage testing (checking battery and charging port output) and continuity/diode mode (hunting for short circuits).

    • DC Power Supply: How to boot a phone motherboard without a battery attached, interpreting current draw (Amperage) to diagnose power management failures.

    • USB Ammeter / Tester: Utilizing an inline USB safety tester plugged into the charging block to instantly diagnose if a phone is pulling normal current ($1A$ to $2A$) or completely dead ($0A$).

    5. Micro-Soldering & Component Level Repair

    For advanced users handling board-level fixes like swapping out charging ports, audio IC chips, or FPC connectors.

    • Soldering Iron Stations: Temperature calibration tips, tip selection (chisel vs. conical), and maintenance/tinning procedures.

    • Hot Air Rework Stations: Managing the delicate balance of air flow and temperature to safely desolder multi-pin components without blowing adjacent surface-mount resistors off the board.

    • Chemical Consumables: Proper application of rosin flux (to clean joints and fluidize solder), solder wick (braided wire to remove old solder), and low-melt solder alloys.

    6. Adhesives, Cleaning & Reassembly

    The final step is cleaning up the internal cavity and sealing the device back up to its original structural integrity.

    • Chemical Cleaners: Safe usage of 99% Isopropyl Alcohol (IPA) to dissolve old glue residues, flux oils, and clean mild liquid damage.

    • Liquid Adhesives vs. Tape: Instructions on applying specialized acrylic glues (like B-7000) versus applying precision-cut double-sided adhesive gaskets.

    • Camping and Curing: Utilizing specialized display repair clamps to apply even, steady pressure while the new adhesives cure over 15 to 30 minutes.

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338S00105 U3500 BIG AUDIO IC

The 338S00105 U3500 BIG AUDIO IC is a crucial integrated circuit (IC) designed to manage audio functions in Apple devices such as the iPhone 6S, 6S Plus, 7, and 7 Plus. As an essential component of the audio system, this IC is responsible for ensuring clear sound output, stable voice transmission, and reliable microphone performance. 338S00105 U3500 BIG AUDIO IC

A damaged or faulty 338S00105 Big Audio IC can lead to common audio-related issues like no sound during calls, malfunctioning loudspeakers, microphone failure, or distorted sound. Therefore, this IC is a vital replacement component in mobile phone repair and is frequently used by professional technicians to restore proper audio functionality in iPhones. 338S00105 U3500 BIG AUDIO IC


Key Features

  1. OEM-Grade Quality

    • The 338S00105 Big Audio IC is designed to meet Apple’s original equipment manufacturer (OEM) specifications.
    • This ensures reliable performance, long-lasting durability, and compatibility with Apple’s audio circuitry. 338S00105 U3500 BIG AUDIO IC
  2. Wide Compatibility

    • This IC is compatible with the following iPhone models:
      • iPhone 6S
      • iPhone 6S Plus
      • iPhone 7
      • iPhone 7 Plus
  3. Precision Engineering

    • The IC is engineered with advanced micro-circuitry to efficiently manage the complex audio processing functions required in Apple devices.
  4. Improved Sound Quality

    • The 338S00105 IC is designed to deliver clear voice quality, strong speaker output, and noise reduction capabilities for improved audio experiences.
  5. Compact and Efficient Design

    • Built in a compact chip layout, the IC efficiently handles multiple audio channels while minimizing power consumption.
  6. Reliable Thermal Performance

    • Engineered to withstand heat buildup during extended usage, ensuring stable performance without overheating.

Common Audio Issues Indicating IC Failure

The 338S00105 (U3500) Big Audio IC is commonly replaced when the following audio-related issues occur in iPhones:

  • No Sound During Calls: The phone may fail to transmit sound during voice calls, even though the speakers and microphones are intact. 338S00105 U3500 BIG AUDIO IC
  • Greyed-Out Speaker Icon: The speaker icon may appear greyed out during calls, preventing audio from functioning properly. 338S00105 U3500 BIG AUDIO IC
  • Microphone Malfunctions: Problems like muffled sound, voice distortion, or complete microphone failure can signal IC damage. 338S00105 U3500 BIG AUDIO IC
  • Boot Loop or Power-On Issues: Some iPhones may experience startup issues, particularly following damage to the audio IC. 338S00105 U3500 BIG AUDIO IC
  • Audio Delay or Echo: Poor sound synchronization in videos, music playback, or calls may indicate a failing IC. 338S00105 U3500 BIG AUDIO IC

Applications

The 338S00105 Big Audio IC is ideal for:

  • iPhone Motherboard Repair: Replacing damaged or defective audio ICs on the logic board.
  • Water Damage Restoration: Repairing devices affected by liquid exposure that compromised the audio circuitry.
  • Drop or Impact Repair: Fixing phones that developed audio issues after physical damage.
  • Speaker and Microphone Issues: Restoring sound functionality in devices with unclear audio signals or greyed-out icons.

Replacement Process for 338S00105 Big Audio IC

Replacing the 338S00105 Big Audio IC requires precision soldering skills and specialized tools. Follow these key steps for successful installation:

  1. Preparation:

    • Power off the device and disconnect the battery.
    • Carefully remove the logic board from the iPhone.
  2. Identifying the IC Location:

    • Locate the U3500 IC on the motherboard, often positioned near the power and audio pathways.
  3. Desoldering the Damaged IC:

    • Use a hot air rework station to gently heat the area around the IC.
    • Carefully lift the damaged IC once the solder joints have melted.
  4. Cleaning the Board:

    • Clean the contact pads with flux and isopropyl alcohol to remove solder residue.
  5. Installing the New IC:

    • Align the new 338S00105 Big Audio IC correctly on the cleaned contact pads.
    • Use a hot air rework station to reflow the solder and secure the IC in place.
  6. Testing the Device:

    • Reassemble the iPhone and test audio functions to confirm the repair’s success.

Recommended Tools for Replacement

To ensure precise and safe installation, the following tools are recommended:

  • Hot Air Rework Station (for heating and desoldering)
  • Precision Tweezers (for accurate IC placement)
  • Soldering Flux (to improve solder flow)
  • Microscope or Magnifying Glass (for inspecting solder joints)
  • ESD-Safe Mat and Tools (to prevent static discharge damage)

Tips for Successful Installation

  1. Preheat the Board: Gradually increase heat to prevent thermal shock to the logic board.
  2. Apply Flux Generously: Ensures smoother solder flow and better adhesion.
  3. Check for Cold Joints: Inspect solder points carefully to ensure no weak connections remain.
  4. Use Proper Alignment Techniques: Incorrect positioning may result in sound distortion or incomplete functionality.

Storage and Handling

To maintain the integrity and performance of the 338S00105 Big Audio IC, follow these guidelines:

  • Store in Anti-Static Packaging: Protect the IC from static electricity that can damage sensitive circuits.
  • Keep in a Cool, Dry Environment: Avoid exposure to moisture, heat, or dust.
  • Handle with ESD Protection: Always wear anti-static gloves or wrist straps when handling the IC.

Why Choose the 338S00105 Big Audio IC?

The 338S00105 (U3500) Big Audio IC is a trusted solution for resolving audio issues in iPhone models such as the 6S, 6S Plus, 7, and 7 Plus. Its robust design, precision engineering, and compatibility with Apple devices make it the go-to choice for professional technicians and repair experts. 338S00105 U3500 BIG AUDIO IC

Whether you’re a repair professional or an experienced DIY enthusiast, this IC offers a reliable way to restore clear, high-quality audio functionality in Apple devices. Its durable construction and OEM-grade performance ensure long-lasting results, improving customer satisfaction and device reliability. 338S00105 U3500 BIG AUDIO IC

For anyone engaged in mobile phone repair, the 338S00105 Big Audio IC is an essential component that guarantees optimal audio restoration and enhanced repair success rates. 338S00105 U3500 BIG AUDIO IC

More Products : https://gsmtoolsindia.com/

338S00105 U3500 BIG AUDIO IC

Official Website : https://www.mechanichk.com/

Weight 0.01 kg

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