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Please read the manual before use.
This section sets the foundation for a safe repair environment. Before a single tool touches a phone, the workspace must be prepared to protect both the technician and the sensitive electronics.
Electrostatic Discharge (ESD) Safety: Instructions on grounding yourself using an ESD wrist strap and working on an anti-static mat to prevent frying microchips with static electricity.
Safety Gear: Protocols for wearing safety glasses (critical when prying shattered glass) and working in a well-ventilated area (crucial for adhesive fumes and soldering smoke).
Lighting and Magnification: Recommendations for high-intensity desk lamps and digital microscopes or magnifying visors for viewing microscopic components.
The most physically risky part of mobile repair is opening the device without cracking the glass screen or ripping delicate internal ribbon cables.
Thermal Tools (Heat Guns & Heat Pads): Instructions on setting precise temperatures (typically 80°C to 100°C) to soften heavy factory adhesives without damaging the display.
Suction & Leverage Tools: Proper placement of heavy-duty suction cups and screen prying fixtures to safely create an initial gap.
Separation Media (Plastic Picks & Spudgers): Techniques for slicing through glue lines using plastic opening picks without inserting them too deeply into the frame.
Modern smartphones use dozens of tiny, highly specialized screws and brackets to hold internal shields in place.
Precision Driver Identification: A breakdown of specialized micro-bits, detailing exactly when to use Pentalobe (iPhones), Tri-point/Y-type (internal Apple shields), Torx/Torx Security (Android devices), and standard Micro-Phillips.
Organization Systems: Guidelines for using magnetic project mats or screw organizing trays to map out screw locations, preventing the catastrophic error of “long-screw damage.”
Gripping & Placer Tools: How to utilize straight and curved ESD-safe tweezers to safely disconnect fragile ZIF (Zero Insertion Force) and coaxial cable connectors.
This section transitions the user from basic mechanical teardowns to logical troubleshooting when a phone won’t turn on or charge.
Digital Multimeter (DMM): Step-by-step instructions on setting up the meter for DC voltage testing (checking battery and charging port output) and continuity/diode mode (hunting for short circuits).
DC Power Supply: How to boot a phone motherboard without a battery attached, interpreting current draw (Amperage) to diagnose power management failures.
USB Ammeter / Tester: Utilizing an inline USB safety tester plugged into the charging block to instantly diagnose if a phone is pulling normal current ($1A$ to $2A$) or completely dead ($0A$).
For advanced users handling board-level fixes like swapping out charging ports, audio IC chips, or FPC connectors.
Soldering Iron Stations: Temperature calibration tips, tip selection (chisel vs. conical), and maintenance/tinning procedures.
Hot Air Rework Stations: Managing the delicate balance of air flow and temperature to safely desolder multi-pin components without blowing adjacent surface-mount resistors off the board.
Chemical Consumables: Proper application of rosin flux (to clean joints and fluidize solder), solder wick (braided wire to remove old solder), and low-melt solder alloys.
The final step is cleaning up the internal cavity and sealing the device back up to its original structural integrity.
Chemical Cleaners: Safe usage of 99% Isopropyl Alcohol (IPA) to dissolve old glue residues, flux oils, and clean mild liquid damage.
Liquid Adhesives vs. Tape: Instructions on applying specialized acrylic glues (like B-7000) versus applying precision-cut double-sided adhesive gaskets.
Camping and Curing: Utilizing specialized display repair clamps to apply even, steady pressure while the new adhesives cure over 15 to 30 minutes.
AMAOE M11 138℃ Solder Paste For today’s compact, heat-sensitive electronics, having the right soldering material can make or break your repair. The AMAOE M11 138℃ Lead-Free Solder Paste is specially engineered for low-temperature soldering, making it the perfect choice for repairing delicate components like mobile phone logic boards, tablets, laptops, and wearables. With a melting point of just 138°C, this solder paste allows technicians to work safely without risking thermal damage to nearby components. AMAOE M11 138℃ Solder Paste
This 100g container of M11 paste is optimized for BGA reballing, micro-soldering, and high-density PCB work, delivering excellent wetting, strong adhesion, and reliable electrical performance—all without lead. Whether you’re a repair technician, an engineer, or a passionate electronics hobbyist, the AMAOE M11 138°C solder paste provides professional-grade performance in every application.
The standout feature of this solder paste is its ultra-low melting point. At just 138°C, it reduces the risk of thermal stress on sensitive components and circuit boards. This makes it ideal for modern electronics where high temperatures can cause warping, delamination, or IC failure.
Crafted from a Sn42Bi58 alloy (42% Tin, 58% Bismuth), this solder paste is completely lead-free, meeting RoHS environmental safety standards. It’s a responsible, health-conscious choice for both technicians and end-users, without compromising on performance.
AMAOE M11 features a high-quality, no-clean flux base. After reflow, the paste leaves behind minimal, non-corrosive residue that does not interfere with electrical performance—meaning less time spent cleaning, and more time repairing.
With its stable viscosity and ultra-fine powder, the paste spreads smoothly and evenly. It works well with manual dispensing, syringes, or stencil printing, offering excellent control for fine-pitch components and intricate soldering tasks.
Despite its low temperature, this solder paste forms strong mechanical bonds and maintains high electrical conductivity, ensuring durable, long-lasting repairs. It performs consistently across a range of rework and reballing operations.
Housed in a sealed, wide-mouth 100g jar, the M11 solder paste offers plenty of material for professional use. The secure lid helps preserve freshness, preventing oxidation and extending shelf life when properly stored.
Perfect for working on iPhones, Samsung Galaxy devices, and other flagship smartphones, where tight layouts and sensitive ICs require low-temperature, high-precision soldering.
Ideal for reballing BGA chips, replacing SMD components, or resoldering damaged pads. Its smooth consistency and low-temp profile minimize the risk of lifting pads or damaging nearby parts. AMAOE M11 138℃ Solder Paste
AMAOE M11 performs beautifully in reflow and soldering tasks on ultrabooks, MacBooks, and tablets, allowing precise work without excess heat. AMAOE M11 138℃ Solder Paste
Smartwatches, fitness bands, hearing aids, and other small form-factor devices benefit from the low heat and clean finish of this paste. AMAOE M11 138℃ Solder Paste
Its fine alloy particles and consistent texture make it excellent for microscope work and tight spaces, reducing the chance of bridging or incomplete joints. AMAOE M11 138℃ Solder Paste
Brand: AMAOE
Product Name: M11 138°C Lead-Free Solder Paste
Weight: 100g
Alloy Composition: Sn42Bi58
Melting Point: 138°C
Flux Type: No-Clean
Form: Soft grey metallic paste
Particle Size: 20–38μm
Storage Temperature: 0–10°C (Refrigerated recommended)
Shelf Life: 6 months (when properly stored)
Packaging: Screw-lid jar for secure resealing
Prep the Surface: Clean PCB pads and component leads thoroughly using isopropyl alcohol and a lint-free cloth or brush. AMAOE M11 138℃ Solder Paste
Apply Paste: Dispense a small amount of solder paste to the pad area using a dispenser, spatula, or stencil.
Reflow: Use a hot air rework station or reflow oven. Set your peak temperature between 160°C–180°C for optimal soldering. Avoid prolonged exposure above 200°C. AMAOE M11 138℃ Solder Paste
Cool Down & Inspect: Let the board cool naturally. Use magnification to inspect the joints for even wetting and shine. Minimal residue may remain but does not affect performance. AMAOE M11 138℃ Solder Paste
Refrigeration Recommended: Keep the paste in a cool environment (0–10°C) to preserve flux activity and prevent drying.
Avoid Contamination: Use clean tools and reseal the jar immediately after use.
Stir Gently Before Use: For best results, stir the paste lightly before each use to ensure a consistent texture.
Do Not Freeze: Freezing can separate the flux and metal components, impacting performance.
The AMAOE M11 Low Temp Solder Paste is engineered for professionals who need dependable, clean, and safe soldering results—especially when working with sensitive electronics. The combination of a 138°C melting point, no-clean flux, lead-free formulation, and smooth application makes it one of the most efficient and technician-friendly pastes available on the market. AMAOE M11 138℃ Solder Paste
Whether you’re repairing flagship smartphones, reballing micro ICs, or assembling compact IoT devices, the AMAOE M11 138°C solder paste gives you the control and precision to get the job done right — without damaging your components or the environment. AMAOE M11 138℃ Solder Paste
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