₹250 Original price was: ₹250.₹139Current price is: ₹139.
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The Amaoe U-SMU1 is a high-precision universal/dedicated BGA reballing stencil specifically engineered for the Samsung Exynos ecosystem. It is a staple tool for micro-soldering technicians performing CPU and RAM “sandwich” repairs or chip swaps.
The U-SMU1 is particularly valued because it covers a wide range of generations, from legacy mid-range chips to modern 5G processors.
Processor (CPU) Support:
Exynos 800 Series: 850, 880
Exynos 900/1000 Series: 980, 990, 1080, 1280
Exynos 7 Series: 7870, 7884, 7885
Legacy/Mid-range: 8895, 3475, 9610, 3830
RAM Support:
Specifically includes patterns for the LPDDR memory chips often layered on top of these CPUs:
RAM 496
RAM 556
Precise Alignment: The stencil features laser-cut apertures that align perfectly with the IC pads, reducing the risk of bridges.
Anti-Bulge Design: The cooling holes and material choice help the stencil remain flat even when subjected to the high temperatures of a quick-heat air station.
Multi-Model Layout: Instead of carrying ten different stencils, this single plate covers the majority of Samsung A-series and S-series repairs from the last several years.
Pro Tip: To get the best results with this stencil, use 183°C leaded solder paste and ensure you wipe the stencil clean with anhydrous alcohol between every heat cycle to prevent carbon buildup in the apertures.
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