₹250 Original price was: ₹250.₹149Current price is: ₹149.
Please read the manual before use.
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The Amaoe VIVO X80 Pro Middle Layer BGA Reballing Stencil (often listed as model X80P-MT or X80P-012) is a high-precision repair tool specifically engineered for the “sandwich” motherboard design of the VIVO X80 Pro. It is used to re-solder the top and bottom motherboard layers by planting solder balls onto the middle frame.
Below are the full specifications for this steel mesh stencil:
Precision Apertures: The square holes are slightly wider at the top than the bottom. This specialized geometry prevents solder paste from getting stuck, ensuring the “tin balls” are released cleanly after heating.
Anti-Warping Material: Made from flexible yet durable stainless steel that can withstand the high temperatures of a hot air gun without “bubbling” or warping during the reballing process.
1:1 Motherboard Match: Specifically mapped to the VIVO X80 Pro’s interposer pads, ensuring that every signal pin between the two motherboard layers is perfectly aligned.
Professional Grade: Designed for use with high-temperature solder pastes (typically 183°C or 138°C depending on the specific repair requirement).
Pro Tip: For the best results with middle layer reballing, it is recommended to use a dedicated heating platform (reballing station) alongside this stencil to ensure even heat distribution across the entire frame.
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