iONE 183°C High Quality Solder Paste

Achieve Seamless Soldering Precision

The iONE 183°C High Quality Solder Paste is crafted to deliver professional-grade results with every application. Its robust formulation ensures high precision and reliability, making it an essential tool for electronic assembly and repairs. Designed for smooth soldering, it helps create strong, durable connections with ease.

Formulated for Consistency and Efficiency

Engineered for optimal melting at 183°C, this solder paste guarantees consistent flow and adhesiveness, which improves workflow efficiency. It minimizes waste and enhances performance, whether you’re handling delicate components or high-volume assembly work. Perfect for professionals and hobbyists alike.

High Quality You Can Trust

Experience the unmatched quality of iONE Solder Paste, featuring a premium-grade composition that meets rigorous industry standards. Safe, reliable, and easy-to-use, this solder paste ensures long-lasting results that bring your projects to life with confidence. Step up your soldering game today!

Here is the comprehensive, full-specification breakdown for the iONE 183°C High-Quality Solder Paste, detailed in an extensive tabular format tailored for technical compliance, electronic assembly, and hardware repair standards.

Technical & Material Specifications

Specification Category	Parameter Details	Technical Metric / Value	Operational Context & Field Impact
Brand Identity	Manufacturer / Line	iONE Tools Series	Authenticated brand for component-level smartphone micro-soldering and SMD electronics. iONE 183°C High Quality Solder Paste
Product Model	Nomenclature	iONE 183°C PPD Solder Paste	Industry recognized as medium-temperature reballing and structural repair paste. iONE 183°C High Quality Solder Paste
Alloy Composition	Chemical Formulation	Sn63 / Pb37 (Eutectic Ratio)	Tin 63% and Lead 37%. Reaches liquidus and solidus states at the exact same temperature to prevent component shifting. iONE 183°C High Quality Solder Paste
Melting Profile	Eutectic Melting Point	183°C (361.4°F)	Medium-temperature tier. Offers an ideal thermal balance that limits heat exposure on delicate ICs while ensuring high structural fatigue resistance. iONE 183°C High Quality Solder Paste
Powder Attributes	Particle Size Class	Type 4 (T4) / Type 5 (T5)	Particle distribution ranges between 15–38 microns. Specifically optimized for micro-pitch stencils used on smartphone logic boards. iONE 183°C High Quality Solder Paste
Flux Type	Chemistry Classification	No-Clean Rosin / Synthesized PPD	Formulated with high-grade synthetic activators that evaporate or clear during thermal reflow, leaving non-corrosive, transparent residue. iONE 183°C High Quality Solder Paste
Viscosity & Flow	Rheology Metrics	180–230 Pa·s (Dynamic Stencil Grade)	Provides excellent slump resistance. The paste retains its printed form through fine-mesh stencils without collapsing before heat application. iONE 183°C High Quality Solder Paste
Halide & Ionic Content	Corrosiveness Threshold	Halide-Free (< 0.05% weight)	Guarantees zero long-term dendritic growth or board degradation beneath micro-BGAs where cleaning is impossible. iONE 183°C High Quality Solder Paste
Wetting Performance	Surface Action Performance	High Activity / Advanced Cleansing	Rapidly breaks down surface oxides on copper, gold-flashed, and nickel-plated pads, allowing bright, spherical solder joint formation.
Insulation Property	Surface Insulation Resistance	> 1 × 10¹² Ohms (Post-Reflow)	Ensures the remaining residue does not cause signal leakage or cross-talk on multi-layered, high-frequency logic lines.
Packaging Size	Physical Mass Variant	35g to 50g Air-Tight Jar	Shipped in heavy-walled polymer jars with inner sealing caps to block ambient oxygen and moisture infiltration during storage.

Application & Environmental Parameters

Operational Field	Recommended Conditions	Engineering Instructions & Deep Technical Context
Primary Applications	Micro-BGA Reballing & SMT	Designed for smartphone CPU reballing, logic board interconnects, IC swaps (Power, Wi-Fi, Audio ICs), charging port replacements, and dense SMD PCB assemblies.
Stencil Compatibility	Laser-Cut & Electroformed	Compatible with 0.10mm to 0.15mm ultra-thin stencils. Smoothly shears out of apertures without leaving clogging fragments inside micro-vias.
Reflow Thermal Ramp	1.5°C – 2.5°C per second	Gradual pre-heating allows the flux vehicles to activate and vent smoothly, preventing volatile outgassing that causes solder spattering or balling.
Peak Reflow Target	210°C – 225°C	The target board temperature should peak roughly 25°C to 40°C above the 183°C melting point for 30–45 seconds to guarantee a full intermetallic bond.
Solder Joint Finish	Mirror-Bright & Homogeneous	Produces fully rounded, highly reflective joints. The absence of dullness or micro-fractures simplifies automatic or manual optical inspections (AOI).
Anti-Oxidant Index	Double-Formula Shielding	Contains proprietary anti-aging compounds that keep the paste active during extended stencil life (up to 8 hours open-air working time).
Storage Temperature	2°C – 10°C (Refrigerated)	Must be stored in a specialized cooling unit to inhibit natural flux-metal separation and prevent premature curing of the polymer carrier.
Working Life	Shelf and Pot Life Stability	6 Months (Sealed Cold Storage); 2-3 Weeks room-temperature open jar cycle before viscosity shifting occurs.
Pre-Use Conditioning	Thermal Stabilization	Must sit at room temperature naturally for 2 to 3 hours before cracking the seal. Do not apply artificial heat. Prevents atmospheric condensation inside the paste.
Cleaning Protocols	Optional Solvent Wash	While classified as “No-Clean,” aesthetic or high-reliability cleaning can be easily performed using Isopropyl Alcohol (IPA) or standard flux removers.
Health & Safety Handling	Lead-Exposure Compliance	Contains elemental lead (Pb). Requires strict adherence to localized safety standards. Wear protective nitrile gloves, avoid smoke inhalation, and utilize fume extractors.

iONE 183°C High Quality Solder Paste

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