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JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil
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JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil

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JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil

Precision Engineering for Effective Repairs

The JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil is meticulously designed for professionals who demand precision and reliability. Perfect for iPhone and Android devices, this jig simplifies CPU, EMMC, and RAM repairs, ensuring optimal results every time.

Unrivaled Versatility

Featuring 14 high-quality stencils, this platform accommodates a wide array of chip sizes and designs. Whether you’re tackling glue removal or reballing tasks, its universal compatibility and ergonomic build make repair projects seamless and frustration-free.

Professional-Grade Durability

Constructed with robust materials, the JTX T4 Pro guarantees longevity and consistent performance, even under continuous use. Its practical design prioritizes both efficiency and ease of use, making it an essential tool for electronic repair specialists.

Specification Parameter Technical Details & Metrics
Product Model JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil
Device Classification Universal BGA Chip Repair Jig & Reballing Platform JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil 
Primary Functions 2-in-1 Design: IC Chip Underfill/Glue Removal & Precision Solder Tin Planting
Chassis Material Premium Cast Iron & High-Grade Alloy Steel BaseJTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil
Clamping Mechanism Advanced Magnetic Dynamic Positioning with Automatic Mechanical Alignment JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil
Thermal Endurance Ultra-high temperature resistance (up to $450^\circ\text{C}$ continuous exposure without warping) JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil
Structural Features Wear-resistant, anti-slip rubber damping, shock-absorbing base pads, non-toxic, odorless construction JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil
Expansion Capability Supports modular component scaling (Up to 84+ individual chip layouts) JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil
Physical Weight Base Unit: ~0.25 kg to 0.28 kg JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil
Baseplate Footprint Approximately $13.5 \times 9.5 \times 2.5\text{ cm}$ (optimized for stereo microscopes) JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil

2. Chip Compatibility & Supported Processors

The JTX T4 Pro is engineered to fit a vast matrix of microchips across iOS and Android ecosystems. It covers 84+ unique chip architectures.

Chip Family Category Fully Supported Semiconductor Models
Apple (iOS Series) A8, A9, A10 Fusion, A11 Bionic, A12, A13, A14, A15, A16, A17 Pro, A18, and A18 Pro
Qualcomm (Snapdragon)

MSM8909, MSM8905, MSM8916/8939, MSM8917, MSM8953, MSM8953-1AB, MSM8937/8940, MSM8996


• Flagship Series: SDM845, SM8150 (SD855), SM8250 (SD865), SM8350 (SD888), SM8450 (Gen 1), SM8475 (Gen 1+), SM8550 (Gen 2), SM8650 (Gen 3), SM8750 (Gen 4)


• Mid-tier Series: SM6115, SM6225, SM6450, SM665, SM6150, SM680, SM7125, SM7150, SM7225, SM7250, SM730G, SM7325, SM7350, SM7475
MediaTek (Dimensity) MT6761V, MT6762V, MT6765V, MT6769V, MT6833V, MT6853V, MT6855V, MT6873V, MT6877V, MT6885Z, MT6893Z, MT6895Z, Dimensity 1100/1200, Dimensity 9200, Dimensity 9300
Samsung (Exynos) Exynos 8895, Exynos 980, Exynos 9820, Exynos 990, Exynos 2100, Exynos 2200
HiSilicon (Huawei Kirin) Kirin 6260, Kirin 6280, Kirin 3660, Kirin 3670, Kirin 3680, Kirin 3690 (4G/5G variants), Kirin 36A0, Kirin 9290/L
Universal Android RAM Dedicated BGA Formats: BGA 376, BGA 436, BGA 496, BGA 556 (LPDDR4 / LPDDR5)
EMMC / UFS Storage Form-factors spanning EMMC 153/169, UFS 2.1, UFS 3.0, UFS 3.1, and UFS 4.0 ICs

3. Stencil Matrix & Packaged Inclusions

The kit comes with 14 specialized high-precision 3D stencils.

Included Component Quantity Functional Role & Design Characteristics
T4 Pro Base Fixture 1 Unit Heavy-duty magnetic clamping dock with built-in glue-scraping card slots.
Apple A-Series Stencils 4 Pieces Laser-etched 3D stencils matching exact ball pitches for A8 through A18 Pro processors.
Qualcomm Snapdragon Stencils 4 Pieces Multi-utility grids designed for specific step-etched depths for flagship Snapdragon SOCs.
MediaTek Dimensity Stencils 2 Pieces High-toughness stencils compensating for the unique thermal expansion of MTK chipsets.
HiSilicon Kirin & Exynos 2 Pieces Dual-branded layouts matching precise pinouts for Huawei and Samsung logic boards.
Universal Storage & RAM Matrix 2 Pieces Multi-row alignments for EMMC, UFS flash storage, and standalone LPDDR BGA RAM.

4. Key Performance Features & Operational Workflow

This table covers how the JTX T4 Pro behaves under professional bench environments and the step-by-step workflow optimization it provides.

Feature / Step Mechanism & Technical Advantage
Magnetic Dynamic Hold Uses high-flux neodymium rare-earth magnetic arrays embedded into the chassis. Automatically centers the 3D stencil over the chip without requiring manual latching screws.
Safe-Grip Degumming Low-profile side clamps secure the chip on its edges without contacting fragile surface-mounted components (SMDs). Allows the technician to scrape off epoxy underfill using a hot-air gun and blade without the chip sliding.
Anti-Warping Alloy The alloy stencils feature laser-cut reliefs that scatter localized heat from a soldering iron or heat station, mitigating oil-canning or thermal deformation during the reballing phase.
Step 1: Chip Placement Secure the dirty IC into the sliding jaw of the T4 Pro platform. The spring-loaded locking slot holds the chip firmly against anti-skid boundaries.
Step 2: Glue Scraping Apply heat ($250^\circ\text{C}$ to $300^\circ\text{C}$) to soften the black or white underfill resin. Use a dedicated chip-cleaning blade to smoothly clear the residue.
Step 3: Stencil Alignment Place the corresponding 3D stencil onto the platform. Magnetic alignment pins grab the stencil and lock it perfectly flush against the IC pads.
Step 4: Solder Paste & Heat Apply low/medium temperature solder paste ($138^\circ\text{C}$ bismuth or $183^\circ\text{C}$ leaded paste). Direct hot air at $320^\circ\text{C}$ over the stencil to reflow perfectly formed uniform spheres across the BGA array.

JTX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 StencilMore Products : https://gsmtoolsindia.com/

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