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Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform
Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform
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Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform

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Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform

Comprehensive Repair Kit for Professionals

The Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform offers everything you need to handle intricate phone repairs with precision. Designed specifically for IPX-17 Pro Max, this kit ensures accuracy and reliability in reballing and soldering tasks.

Optimal Magnetic Middle Layer Platform

Equipped with a magnetic middle layer soldering platform, the RL-601T enhances ease of alignment and stability during repair processes. Its innovative design minimizes errors, allowing you to achieve professional-grade results effortlessly.

Durable and Versatile Stencil Selection

This 31-in-1 kit includes high-quality reballing stencils, crafted for durability and compatibility across various models. Whether you’re fixing circuit boards or soldering micro-components, this versatile toolset provides everything you need to tackle complex repairs with confidence.

The Relife Tools RL-601T 31-in-1 Magnetic Middle Layer Reballing Platform is a professional-grade hardware repair solution designed specifically for advanced technicians dealing with multi-layered (sandwiched) smartphone logic boards. It offers precise alignment and uniform solder ball formation across multiple generations of iPhones, expanding up to the iPhone 17 Pro Max.

Below is the exhaustive, full technical specification of the Relife RL-601T kit detailed in comprehensive technical matrices.

1. General Identification & Product Overview

Specification Parameter Detailed Technical Specification Data & Description
Brand / Manufacturer RELIFE Tools (A premier subsidiary of Sunshine Tools Group)
Product Model Number RL-601T (31-in-1 Configuration Variant)
Product Classification BGA Middle Layer Tin Planting & Soldering Alignment Fixture Set
Target Application Sandwiched PCB Logic Board Layer Separation, Reballing, and Re-alignment
Core Design Mechanism Universal Modular Base Architecture with Interchangeable Magnetic Stencils
Industry Certification CE Compliant, RoHS Eco-Friendly Material Standards

2. Smartphone Compatibility Matrix

Device Series Compatible Models Covered by the Kit
iPhone X Series iPhone X, iPhone XR, iPhone XS, iPhone XS Max
iPhone 11 Series iPhone 11, iPhone 11 Pro, iPhone 11 Pro Max
iPhone 12 Series iPhone 12, iPhone 12 Mini, iPhone 12 Pro, iPhone 12 Pro Max
iPhone 13 Series iPhone 13, iPhone 13 Mini, iPhone 13 Pro, iPhone 13 Pro Max
iPhone 14 Series iPhone 14, iPhone 14 Plus, iPhone 14 Pro, iPhone 14 Pro Max
iPhone 15 Series iPhone 15, iPhone 15 Plus, iPhone 15 Pro, iPhone 15 Pro Max
iPhone 16 Series iPhone 16, iPhone 16 Plus, iPhone 16 Pro, iPhone 16 Pro Max, iPhone 16e
iPhone 17 Series iPhone 17, iPhone 17 Air, iPhone 17 Pro, iPhone 17 Pro Max

3. Structural Materials & Component Specifications

Component Layer Material Composition Structural Properties & Manufacturing Process
Platform Base Deck Industrial Heavy-Duty Metal Alloy Integrated with Synthetic Stone CNC precision-milled base. The synthetic stone acts as a thermal barrier to prevent localized heat dissipation into the workspace. Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform
Reballing Stencils Ultra-Premium Laser-Cut Stainless Steel Netting Precision square-and-round hybrid mesh holes. Manufactured with an anti-drumming topology to prevent buckling under high heat. Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform
Magnetic Core N52-Grade Neodymium Rare Earth Permanent Magnets Multi-point embedded configuration. Engineered to withstand high-temperature thresholds without losing magnetic flux density. Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform
Under-Base Insulation High-Density Vulnerability-Resistant Synthetic Stone Provides high mechanical tensile strength and resistance against flux residues, chemical solvents, and scratches. Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform
Chassis Foot Pads High-Friction Vulcanized Silicone Rubber Non-slip, anti-aging, shock-absorbing design that anchors the platform securely to ESD work mats during scraping. Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform

4. Key Functional Features & Engineering Technology

Feature Set Engineering Implementation Technical Benefit for Micro-Soldering
Magnetic Alignment Three-point high-temperature strong magnetic clamping Eliminates the need for manual hold-down or mechanical toggle clamps, preventing stencil shifting or misalignment.
Anti-Drumming Design Heat-expansion stress-relief structural zones on steel net Prevents the stencil from bulging or warping up when subjected to direct 300°C–380°C hot air gun streams.
Hybrid Mesh Pattern Alternating round and square micro-perforations Maximizes solder paste entry efficiency and guarantees uniformly full, perfectly rounded solder balls upon reflow.
Universal Base Topology Forward-compatible “Unlimited Stacking” layout slot Allows technicians to use newly released expansion modules for future phone models without buying a new base.
Real Machine Proofing 1:1 original factory drawing CAD trace calibration Ensures every single micro-solder pad, alignment pin slot, and SIM tray isolation shield matches the motherboard perfectly.

5. 31-in-1 Kit Package Contents Breakdown

Item Category Quantity Included Functional Role Within the Kit
Universal Magnetic Base 1 Unit Houses the permanent magnets, alignment steps, and non-slip feet to support all interchangeable layers.
Interchangeable Modules 6 Pieces Custom-molded structural inserts designed to perfectly cradle the odd shapes of various iPhone logical boards.
BGA Steel Stencils 23 Pieces High-precision stencils mapping the exact mid-tier solder patterns for models ranging from iPhone X up to 17 Pro Max.
SIM Isolation Shield 1 Piece Specialized stencil mask designed to shield the SIM tray slot from accidental solder paste flooding.
Product QC & Manual 1 Set Verification certificate, instructional guide, and protective hard carton packaging.

6. Mechanical, Thermal, and Physical Dimensions

Physical Metric Parameter Technical Value / Rating Measurement Standard / Condition
Maximum Operating Temperature 500°C (Base Structure Continuous) Directly exposed to standard SMD rework station hot air nozzles
Stencil Thickness 0.12 mm to 0.15 mm Balanced for optimal solder paste volume retention
Magnetic Curie Temperature > 180°C Thermal Retention Threshold Retains strong alignment capabilities under continuous mid-layer reflow cycles
Base Dimensions (Approx.) 102 mm × 60 mm × 15 mm Optimized handheld workbench real estate
Net Structural Weight ~280 grams (Base Component only) Provides excellent stability without excessive mass
Chemical Resistance Proof against Isopropyl Alcohol (IPA), Rosin Flux, Acetone No structural degradation or surface pitting over extended exposure

7. Application Workflow & Maintenance Profile

Operational Phase Recommended Technical Parameters & Care
Solder Paste Choice Medium-temperature (183°C Sn63/Pb37) or Low-temperature (138°C Bi-alloy) solder pastes. Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform
Scraping Angle A 45-degree angle blade stroke is recommended across the precision hole pattern to ensure full filling. Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform
Rework Airflow Spec Recommended hot air station settings: 330°C–360°C with an air velocity scale of 35% to 45%. Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform
Cleaning Protocol Clean with an ultra-fine ESD brush soaked in standard PCB cleaning solvent or 99.9% industrial-grade IPA. Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform
Storage Standard Store in a low-humidity environment; ensure stencils remain flat inside their protective sleeves to avoid bending. Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform

Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform

More Products : https://gsmtoolsindia.com/product/ck-tools-smartcut-pro-x17-m8-hydrogel-screen-protector-cutting-plotter-machine-for-mobile-tablet-watch-and-laptop/

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