Amaoe SU3 The Amaoe SU3 0.12mm BGA Reballing Stencil is an essential tool for micro-soldering professionals and electronics repair specialists. Designed for precise BGA (Ball Grid Array) reballing, this high-precision stencil enables efficient and accurate IC chip solder ball placement and reflow. With a fine 0.12mm thickness, the stencil ensures clean, sharp solder ball alignment, … Continue reading Amaoe SU3 0.12mm BGA Reballing Stencil