iONE 138°C High Quality Solder Paste

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Product Description

iONE 138°C High Quality Solder Paste

Introducing iONE 138°C Solder Paste

The iONE 138°C High Quality Solder Paste is engineered to deliver reliable results for temperature-sensitive soldering projects. Crafted from premium materials, this paste guarantees precision and consistency, making it indispensable for various applications including electronics assembly and repair.

Exceptional Performance at Low Melting Point

With an optimized 138°C melting point, the iONE Solder Paste is ideal for delicate components requiring low-temperature soldering. Its high quality composition ensures reduced thermal stress while maintaining durable and robust connections critical for resilient circuit performance.

Superior Quality You Can Trust

Designed to meet the demands of hobbyists and professionals alike, the iONE 138°C Solder Paste offers easy application, minimal residue, and smooth solder flow. Whether you’re working on intricate electronics or large-scale assemblies, this solder paste delivers the reliability and efficiency you need.

The comprehensive technical datasheet and complete specification report for the iONE 138°C Low-Temperature High-Quality Solder Paste is presented below. This detailed technical breakdown is structured entirely into granular, analytical tables covering every aspect from physical attributes to thermal reflow profiling and compliance, followed by handling and performance parameters.

Section 1: Core Physical & Chemical Composition

This section details the metallurgical makeup, element distribution, and chemical matrix of the iONE alloy.

Parameter Classification	Technical Specification Details	Architectural Function & Impact
Brand / Manufacturer	iONE	Original Equipment Manufacturer (OEM) standard repair tooling
Product Category	Low-Temperature PPD Solder Paste	Targeted for heat-sensitive multi-layered PCB micro-soldering
Alloy Designation	Sn42Bi58 (Eutectic Tin-Bismuth Alloy)	Ensures sharp, immediate phase transition without plastic states
Metallic Composition Ratio	42% Tin (Sn) / 58% Bismuth (Bi)	Pure binary mix designed to drop the melting point from standard 183°C/217°C
Flux Classification Code	ROL0 (Rosin-based, Low Activity, Halide-Free)	Guarantees non-corrosive residue, safe for long-term electronics
Flux Content Percentage	9.5% to 10.5% by total weight	Balances metal density with adequate wetting and oxide cleaning
Halide & Chlorine Content	0.00% (Halide-Free formulation)	Eliminates risk of ionic degradation or dendritic growth post-cure
Powder Particle Size Type	Type 4 (T4 Micron Classification)	Tailored for fine-pitch stencil aperture printing down to 0.3mm
Particle Size Distribution Range	20 – 38 Microns ( $\mu$ m)	Prevents stencil clogging while maintaining uniform sphere alignment
Sphere Geometry Rating	$\ge$ 95% Perfect Spherical Distribution	High uniformity ensures predictable paste release and minimal voiding

Section 2: Thermal Dynamics & Melting Specifications

Thermal characteristics dictate how the paste reacts under a hot-air rework station or reflow oven.

Thermal Property Metric	Exact Operational Value	Impact on Motherboard Component Safety
Solidus Temperature	138°C (280.4°F)	Begins changing phase smoothly at significantly reduced heat
Liquidus Temperature	138°C (280.4°F)	Reaches fully fluid, high-mobility state instantly due to eutectic behavior
Optimal Rework Air Temp	160°C – 180°C	Protects delicate CPUs, PMICs, and internal structures from delamination
Peak Reflow Limit	190°C (Maximum Tolerance Limit)	Prevents thermal shock to nearby plastic connectors or glue-filled ICs
Thermal Conductivity	~19 W/m·K	Delivers efficient heat dissipation through finished joints
Surface Wetting Tension	High cohesive capillary draw	Automatically pulls solder spheres together onto copper pads
Intermetallic Layer Thickness	0.5 – 1.5 $\mu$ m	Provides structural strength without creating brittle joint interfaces

Section 3: Rheological & Mechanical Performance Specifications

Rheology covers printability, viscosity, and mechanical threshold limits after curing.

Mechanical Vector	Baseline Data Parameters	Application Phase Significance
Viscosity Index Range	160 – 210 Pa·s (Pascal-seconds)	Balanced to avoid slump during heating while allowing clean stencil lift
Thixotropic Index	0.52 – 0.58	Softens under pressure (printing), solidifies at rest (holding)
Anti-Slump Resistance	Excellent (Zero structural slump at 100°C)	Prevents bridging or short-circuiting between ultra-fine BGA balls
Tack Force Time window	$\ge$ 16 Hours continuous	Retains stickiness to hold components firmly prior to hot air reflow
Tensile Strength Capacity	55 – 62 MPa (Megapascals)	High tensile tolerance against motherboard bending or drop drops
Shear Strength Capacity	45 – 50 MPa	Resists horizontal mechanical stress from thermal expanding cycles
Solder Joint Brilliance	Mirror-bright, highly reflective finish	Simplifies post-repair optical inspections under microscopes

Section 4: Electrical Safety & Reliability Attributes

This matrix lists parameters that prevent short circuits and structural deterioration over thousands of power cycles.

Insulation & Life Metric	Verified Threshold Rating	Safety/Longevity Value
Surface Insulation Resistance	$\ge 1.0 \times 10^{11} \ \Omega$ (As per IPC-TM-650)	High resistance prevents micro-current leakage between dense traces iONE 138°C High Quality Solder Paste
Electromigration Tendency	None detected under continuous voltage	Guarantees trace metal won’t migrate or bridge under high loads iONE 138°C High Quality Solder Paste
Corrosion Tendency Rating	Non-corrosive pass rating (IPC standards)	Residue remains completely chemically inert over product lifetime iONE 138°C High Quality Solder Paste
Voiding Index Classification	Class 1 (IPC-7095 Standard Compliance)	Keeps internal air gaps below 10%, ensuring full structural path iONE 138°C High Quality Solder Paste
False Welding Frequency	Near 0.0% under ideal reflow profile	Eliminates intermittent structural issues on mobile logic boards

Section 5: Target Applications & Compatibility Matrix

The optimal deployment cases where iONE 138°C outperforms standard high-temperature pastes.

Core Target Workloads	Motherboard Subsystem Suitability	Material Compatibility Parameters
iPhone Middle-Layer Sandwich	Double-stacked PCBs (iPhone X through 15 Pro)	Allows splitting and re-joining boards without melting internal ICs
Sensitive BGA Reballing	CPU, Baseband, NAND, Wi-Fi Modules	Safe reballing on chips vulnerable to internal trace popping
SMT Patch & Prototype Repair	High-density multi-layered logic boards	Prevents copper pad lifting caused by overheating localized spots
Compatible Stencil Types	Stainless Steel, Laser-Cut, Electropolished	Releases cleanly down to 0.10mm and 0.12mm stencil variants
Substrate Compatibility	FR4, Flexible Polyimide PCBs, Ceramic Boards	Bonds to standard OSP, HASL, and ENIG (Gold) surface finishes

Section 6: Environmental, Storage, & Packaging Parameters

Guidelines required to maintain the long-term chemical shelf-life and chemical stability of the paste.

Storage Vector	Environmental Standard Requirements	Operational Longevity Impact
Standard Net Packaging Weight	Available in 40g and 50g standard containers	Compact jar shapes minimize air contact and preserve product iONE 138°C High Quality Solder Paste
Optimal Storage Temperature	0°C to 10°C (32°F – 50°F)	Refrigeration slows chemical oxidation and flux separation iONE 138°C High Quality Solder Paste
Unopened Shelf Life	6 Months from date of manufacture	Ensures consistent viscosity over long storage windows iONE 138°C High Quality Solder Paste
Open Pot Life Working Time	8 Hours inside climate-controlled room	Gives technicians a full shift window before drying out iONE 138°C High Quality Solder Paste
Pre-Use Warm-Up Buffer	2 Hours at room temperature (25°C)	Prevents moisture condensation which can cause explosive spitting iONE 138°C High Quality Solder Paste
Post-Solder Cleaning Profile	“No-Clean” formula; alcohol wash optional	Transparent residue does not need washing unless aesthetic clean is required iONE 138°C High Quality Solder Paste