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Mijing Z20 Pro Reballing Stencil Fixture kits for iPhone 17 Series Original price was: ₹2,000.Current price is: ₹1,099.
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MJ Mijing Z20 PRO Middle Layer BGA Reballing Stencil Platform Fixture for iPhone X-16 Pro Max Motherboard Soldering Repair

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Original price was: ₹6,000.Current price is: ₹4,499.

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MJ Mijing Z20 PRO Middle Layer BGA Reballing Stencil Platform Fixture for iPhone X-16 Pro Max Motherboard Soldering Repair

Professional-Grade Soldering Repair Tool

The MJ Mijing Z20 PRO Middle Layer BGA Reballing Stencil Platform Fixture for iPhone X-16 Pro Max Motherboard Soldering Repair is meticulously crafted to meet the demands of precision iPhone motherboard repairs. Designed for use with iPhone X to 16 Pro Max models, this tool ensures stability and accuracy during delicate soldering tasks.

Enhance Repair Efficiency

Featuring a well-calibrated middle-layer fixture platform, the Z20 PRO aids in maintaining alignment for efficient MJ Mijing Z20 PRO Middle Layer BGA Reballing Stencil Platform Fixture for iPhone X-16 Pro Max Motherboard Soldering Repair. This versatile tool is suitable for professional technicians and repair enthusiasts alike, providing consistent results with minimal effort.

Durable and Easy to Use

Constructed with high-quality materials, the MJ Mijing Z20 PRO Middle Layer BGA Reballing Stencil Platform Fixture for iPhone X-16 Pro Max Motherboard Soldering Repair guarantees durability and reliability for repeated use. Its user-friendly design ensures easy setup and operation, making it an indispensable addition to your repair toolkit.

The MJ Mijing Z20 PRO Middle Layer BGA Reballing Stencil Platform Fixture for iPhone X-16 Pro Max Motherboard Soldering Repair is an industry-standard, precision-engineered hardware tool used by micro-soldering technicians. It specifically addresses the challenges of repairing layered logic boards (sandwiched PCBs) found in Apple iPhones from the iPhone X up to the iPhone 16 Pro Max.

 

Below is the comprehensive, full technical specification sheet and operational overview formatted entirely in a scannable, detailed tabular structure. MJ Mijing Z20 PRO Middle Layer BGA Reballing Stencil Platform Fixture for iPhone X-16 Pro Max Motherboard Soldering Repair

1. General Product Identification & Branding

Parameter Specification Details
Brand Name MJ / Mijing
Model Designation Z20 PRO (Upgraded Multi-Model Edition)
Product Category Micro-soldering Equipment / BGA Repair Jig
Primary Tool Function Interlayer (Middle Frame) Tin Planting & Reballing Alignment
Target Audience Professional Smartphone Board-Level Repair Technicians

2. Structural & Material Specifications

Feature Engineering & Material Details
Base Baseplate Material Premium CNC-machined Aircraft-Grade Aluminum Alloy MJ Mijing Z20 PRO Middle Layer BGA Reballing Stencil Platform Fixture for iPhone X-16 Pro Max Motherboard Soldering Repair
Surface Treatment Anodized finish for anti-static, anti-scratch, and oxidation wear resistance
Magnetic System High-strength NdFeB (Neodymium) Permanent Magnets embedded into the base
Stencil Composition Laser-cut, high-precision Ultra-thin Stainless Steel sheet (0.12mm default thickness)
Aperture Design Precision square-hole openings to prevent solder ball overflow and bridging
Thermal Properties High-temperature structural integrity; resists deformation under indirect heat up to 300°C
Thermal Insulation Built-in heat dissipation paths and multi-functional synthetic insulating mats MJ Mijing Z20 PRO Middle Layer BGA Reballing Stencil Platform Fixture for iPhone X-16 Pro Max Motherboard Soldering Repair

3. Physical Dimensions, Weight & Packaging

Dimension Factor Metrics & Technical Data
Fixture Base Size Approximately $130 \times 78 \times 40\text{ mm}$ (Compact bench-friendly footprint)
Net Base Weight $\approx 250\text{ grams}$ (Weighted to ensure zero sliding on the workbench)
Gross Kit Weight $\approx 560 – 620\text{ grams}$ (Varies by bundled stencil modules)
Packaging Box Type High-density Shockproof Hard Carton Box with custom EVA foam inserts MJ Mijing Z20 PRO Middle Layer BGA Reballing Stencil Platform Fixture for iPhone X-16 Pro Max Motherboard Soldering Repair
Standard Box Dimensions $150 \times 100 \times 55\text{ mm}$

4. Hardware Bundle & In-Box Components

Component Component Included Quantity & Technical Purpose
Z20 Pro Base Fixture 1 Unit (Universal magnetic docking station with alignment columns)
Steel Mesh Stencils 22x Interchangeable Tin Plating Steel Meshes (Varies by package setup)
Functional Gaskets 6x Synthetic rubber/silicone insulation positioning shims
Tin Scraping Blades Optional/Bundle dependent (Used for smooth solder paste leveling)

5. Matrix of Supported iPhone Architecture Models

iPhone Generation Specific Sub-Models Accommodated
iPhone 16 Series iPhone 16, 16 Plus, 16 Pro, 16 Pro Max
iPhone 15 Series iPhone 15, 15 Plus, 15 Pro, 15 Pro Max
iPhone 14 Series iPhone 14, 14 Plus, 14 Pro, 14 Pro Max
iPhone 13 Series iPhone 13, 13 Mini, 13 Pro, 13 Pro Max
iPhone 12 Series iPhone 12, 12 Mini, 12 Pro, 12 Pro Max
iPhone 11 Series iPhone 11, 11 Pro, 11 Pro Max
iPhone X Series iPhone X, XR, XS, XS Max

6. Functional Mechanics & Performance Features

Operational Mechanism Mechanical Functionality Description
Automatic Alignment Dual guide pins combined with powerful magnetic tracking snap stencils into dead-center alignment instantly.
Anti-Bulging Formula Stencil architecture utilizes specialized stress-relief slots that prevent the steel from buckling or warping under high temperatures.
Solder Bead Retention Custom square apertures hold liquid solder paste uniformly, forming consistent $320\mu\text{m}$ to $400\mu\text{m}$ solder spheres upon melting.
Interlayer Shielding Protects the underlying delicate Baseband, CPU, and peripheral logic chips from direct thermal over-exposure during the middle frame merging process.

7. Comprehensive Step-by-Step Operating Protocol

Step Phase Core Technical Actions Required
Step 1: Preparation Clean the split middle frame of the upper/lower logic boards using a soldering iron, wick, and Isopropyl Alcohol (IPA) until completely flat.
Step 2: Shim Setting Insert the dedicated multi-functional positioning gasket matching the specific iPhone model into the magnetic base slot.
Step 3: Board Seating Place the lower motherboard onto the guide pins. Verify it rests completely flush without structural rocking.
Step 4: Stencil Snap Lower the corresponding model-specific stencil onto the board. The magnetic core will lock it directly over the micro-pads.
Step 5: Paste Application Spread low-temperature ($138^\circ\text{C}$) or medium-temperature ($183^\circ\text{C}$) solder paste evenly over the stencil holes with a clean scraper blade.
Step 6: Separation CRITICAL: Carefully peel or lift off the magnetic stencil before applying raw heat. This step prevents the stencil from warping or trapping structural heat.
Step 7: Reflow Heating Use a hot air rework gun (recommended setting: $280^\circ\text{C} – 320^\circ\text{C}$ at low airflow) to melt the printed solder paste cubes into uniform, shiny solder balls.

8. Safety, Care & Maintenance Guidelines

Maintenance Category Best Practice Protocol
Chemical Cleaning Clean all stencils immediately after use using a soft brush dipped in PCB cleaner or 99% IPA to prevent dried paste from choking micro-apertures.
Storage Parameters Store steel sheets flat inside protective sleeves. Do not stack heavy objects directly on top of the thin stencils.
Magnetic Protection Avoid contacting the magnetic baseplate directly with open torch flames or temperatures scaling above $350^\circ\text{C}$ to mitigate demagnetization risks.

 

MJ Mijing Z20 PRO Middle Layer BGA Reballing Stencil Platform Fixture for iPhone X-16 Pro Max Motherboard Soldering Repair

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Weight 1 kg

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