RELIFE 210 Replaceable Jumper Soldering Tip Set Precision Tip Replaceable for Mobile Phone Repair Rework Soldering Tool

Original price was: ₹1,000.Current price is: ₹649.

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Original price was: ₹1,000.Current price is: ₹649.

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  • User Guide

    User Guide

    Please read the manual before use.

    1. Introduction & Workspace Setup

    This section sets the foundation for a safe repair environment. Before a single tool touches a phone, the workspace must be prepared to protect both the technician and the sensitive electronics.

    • Electrostatic Discharge (ESD) Safety: Instructions on grounding yourself using an ESD wrist strap and working on an anti-static mat to prevent frying microchips with static electricity.

    • Safety Gear: Protocols for wearing safety glasses (critical when prying shattered glass) and working in a well-ventilated area (crucial for adhesive fumes and soldering smoke).

    • Lighting and Magnification: Recommendations for high-intensity desk lamps and digital microscopes or magnifying visors for viewing microscopic components.

    2. Disassembly & Opening Tools

    The most physically risky part of mobile repair is opening the device without cracking the glass screen or ripping delicate internal ribbon cables.

    • Thermal Tools (Heat Guns & Heat Pads): Instructions on setting precise temperatures (typically 80°C to 100°C) to soften heavy factory adhesives without damaging the display.

    • Suction & Leverage Tools: Proper placement of heavy-duty suction cups and screen prying fixtures to safely create an initial gap.

    • Separation Media (Plastic Picks & Spudgers): Techniques for slicing through glue lines using plastic opening picks without inserting them too deeply into the frame.

    3. Fastener & Component Manipulation

    Modern smartphones use dozens of tiny, highly specialized screws and brackets to hold internal shields in place.

    • Precision Driver Identification: A breakdown of specialized micro-bits, detailing exactly when to use Pentalobe (iPhones), Tri-point/Y-type (internal Apple shields), Torx/Torx Security (Android devices), and standard Micro-Phillips.

    • Organization Systems: Guidelines for using magnetic project mats or screw organizing trays to map out screw locations, preventing the catastrophic error of “long-screw damage.”

    • Gripping & Placer Tools: How to utilize straight and curved ESD-safe tweezers to safely disconnect fragile ZIF (Zero Insertion Force) and coaxial cable connectors.

    4. Diagnostics & Testing Equipment

    This section transitions the user from basic mechanical teardowns to logical troubleshooting when a phone won’t turn on or charge.

    • Digital Multimeter (DMM): Step-by-step instructions on setting up the meter for DC voltage testing (checking battery and charging port output) and continuity/diode mode (hunting for short circuits).

    • DC Power Supply: How to boot a phone motherboard without a battery attached, interpreting current draw (Amperage) to diagnose power management failures.

    • USB Ammeter / Tester: Utilizing an inline USB safety tester plugged into the charging block to instantly diagnose if a phone is pulling normal current ($1A$ to $2A$) or completely dead ($0A$).

    5. Micro-Soldering & Component Level Repair

    For advanced users handling board-level fixes like swapping out charging ports, audio IC chips, or FPC connectors.

    • Soldering Iron Stations: Temperature calibration tips, tip selection (chisel vs. conical), and maintenance/tinning procedures.

    • Hot Air Rework Stations: Managing the delicate balance of air flow and temperature to safely desolder multi-pin components without blowing adjacent surface-mount resistors off the board.

    • Chemical Consumables: Proper application of rosin flux (to clean joints and fluidize solder), solder wick (braided wire to remove old solder), and low-melt solder alloys.

    6. Adhesives, Cleaning & Reassembly

    The final step is cleaning up the internal cavity and sealing the device back up to its original structural integrity.

    • Chemical Cleaners: Safe usage of 99% Isopropyl Alcohol (IPA) to dissolve old glue residues, flux oils, and clean mild liquid damage.

    • Liquid Adhesives vs. Tape: Instructions on applying specialized acrylic glues (like B-7000) versus applying precision-cut double-sided adhesive gaskets.

    • Camping and Curing: Utilizing specialized display repair clamps to apply even, steady pressure while the new adhesives cure over 15 to 30 minutes.

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RELIFE 210 Replaceable Jumper Soldering Tip Set Precision Tip Replaceable for Mobile Phone Repair Rework Soldering Tool

Exceptional Precision for Professional Repairs

The RELIFE 210 Replaceable Jumper Soldering Tip Set Precision Tip Replaceable for Mobile Phone Repair Rework Soldering Tool is engineered with precision in mind, making it the ideal tool for mobile phone repair and intricate rework tasks. Whether you’re a professional technician or a DIY enthusiast, these precision tips ensure accurate and clean soldering every time. RELIFE 210 Replaceable Jumper Soldering Tip Set Precision Tip Replaceable for Mobile Phone Repair Rework Soldering Tool

Durable and Replaceable Design

This soldering tip set offers durability and flexibility with its replaceable design. Each tip is crafted to withstand high temperatures and repeated use, giving you a reliable toolset for extended periods of work. With the ease of replacing tips, you can keep your soldering tool operating at peak performance. RELIFE 210 Replaceable Jumper Soldering Tip Set Precision Tip Replaceable for Mobile Phone Repair Rework Soldering Tool

Versatile and Easy to Use

RELIFE 210 Jumper Soldering Tips are designed to suit a variety of repair applications. From small electronic components to intricate phone circuits, these tips provide exceptional control and compatibility with different soldering tasks. Make fine, detailed repairs effortless with tips you can trust. RELIFE 210 Replaceable Jumper Soldering Tip Set Precision Tip Replaceable for Mobile Phone Repair Rework Soldering Tool

Technical Category Specification Parameter Detailed Operational Details & Metrics
Product Brand & Model Brand RELIFE
Model Number RL-210 / 210 Series Set
Product Name Replaceable Jumper Soldering Tip Set
Material & Construction Base Metal Core Premium Oxygen-Free Oxygen-Coated Red Copper (High Thermal Conductivity)
Plating Layers Multi-layer electroplating: Iron layer, Nickel layer, Chromium layer (Anti-corrosion/Anti-oxidation)
Tip Point Treatment Pre-tinned precision tip with micro-alloy coating for immediate wetting
Structural Design Split-type design with a permanent structural body and replaceable inner micro-tips
Dimensional Metrics Total Handle Length Approximately $85\text{ mm}$ (Standard handle attachment frame)
Interchangeable Tip Diameter Micro-fine tip profile down to $0.1\text{ mm}$ to $0.3\text{ mm}$ for microscopic jumping
Net Weight $\approx 15\text{ grams}$ (Ultra-lightweight to eliminate user hand fatigue)
Gross Weight (with case) $\approx 35\text{ grams}$
Thermal Performance Temperature Range $100^\circ\text{C}$ to $480^\circ\text{C}$ ($212^\circ\text{F}$ to $896^\circ\text{F}$)
Thermal Efficiency Rapid thermal recovery system ($<3$ seconds from standby to active melting point)
Heat Loss Coefficient Minimum thermal dissipation at the joints due to tight-tolerance screw thread locking
Compatibility Specs Soldering Iron Station Compatible with T210 / T26 / JBC 210 style precision handles
Heating Element Internal matrix cartridge integration compatibility
Application Scope Primary Target Work Micro-soldering, CPU jump wiring, BGA reballing chip repairs, Face ID flex fixes
Secondary Target Work PCB trace repair, pad restoration, microscopic SMD component placement ($01005$ components)

Detailed Performance Breakdown & Functional Engineering

Functional Area Engineering Parameter Performance Capability & Utility Description
Interchangeable Design Matrix Locking Mechanism Precision screw-thread mechanical interlocking interface that prevents tip wobbling
Cost Efficiency Factor Eliminates the need to replace the entire integrated heating cartridge; only the micro-tip is discarded
Changing Process Hot-swappable capability using a heat-resistant silicone pad or basic mechanical tip puller RELIFE 210 Replaceable Jumper Soldering Tip Set Precision Tip Replaceable for Mobile Phone Repair Rework Soldering Tool
Anti-Oxidation Chemistry Corrosion Resistance Chrome-plated exterior jacket repels black carbonization and active chemical flux residues RELIFE 210 Replaceable Jumper Soldering Tip Set Precision Tip Replaceable for Mobile Phone Repair Rework Soldering Tool
Tinning Capability High-density iron plating layer allows instantaneous solder wire adhesion without pooling RELIFE 210 Replaceable Jumper Soldering Tip Set Precision Tip Replaceable for Mobile Phone Repair Rework Soldering Tool
Lifespan Metric Rated for up to $30,000$ to $50,000$ individual solder joints under optimal temperature usage ($350^\circ\text{C}$)
Electrical Integrity ESD Protection Fully ESD-Safe design; zero static voltage leakage to delicate IC chips and CMOS components
Grounding Resistance $< 2\text{ ohms}$ structural grounding path compliance to protect sensitive logic boards

Geometry Profiles & Specific Micro-Tip Applications

Tip Shape Style Tip Point Point Radius Targeted Board-Level Troubleshooting Tasks
Ultra-Fine Straight (I-Tip) $0.10\text{ mm}$ Flying jump wires under CPU chips; repairing torn pads on iPhone motherboard middle layers.
Bent Precision (IS-Tip) $0.15\text{ mm}$ ($45^\circ$ angle) Micro-soldering under microscope lenses where vertical line-of-sight is obstructed by components.
Knife/Chisel Profile (K-Tip) $1.5\text{ mm}$ to $2.0\text{ mm}$ Clearing black glue, removing residual solder from underlying chip pads, drag soldering multi-pin ICs.

Operational Standards, Storage & Maintenance Guidelines

Lifecycle Phase Process Step Professional Bench Protocol & Best Practices
Initial Initialization First-Time Heating Set station to $250^\circ\text{C}$; apply high-purity rosin-core solder immediately to coat the virgin plating layer.
Daily Bench Settings Working Temp Limit Keep working temperatures between $330^\circ\text{C}$ and $360^\circ\text{C}$ to avoid early structural plating degradation.
Maintenance Routine Cleaning Medium Clean exclusively via brass wire sponges or specialized tip tinner compounds; avoid wet cellulose sponges.
Standby Routine Always apply a thick defensive layer of fresh solder wire on the tip face before placing the iron into the cradle.
Environmental Limits Storage Environment Store in the provided dry, sealed anti-humidity protective box to completely prevent air-induced oxidation.

📝 Technical Note for Master Technicians

The RELIFE 210 Replaceable System shifts the standard industry paradigm by separating the expensive heating element structure from the wearable point of contact. This provides a massive reduction in consumables overhead for high-volume repair labs while preserving the exact thermal recovery curves required for dense, multi-layer smartphone logic boards.

RELIFE 210 Replaceable Jumper Soldering Tip Set Precision Tip Replaceable for Mobile Phone Repair Rework Soldering Tool

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Weight 0.3 kg

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