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Please read the manual before use.
This section sets the foundation for a safe repair environment. Before a single tool touches a phone, the workspace must be prepared to protect both the technician and the sensitive electronics.
Electrostatic Discharge (ESD) Safety: Instructions on grounding yourself using an ESD wrist strap and working on an anti-static mat to prevent frying microchips with static electricity.
Safety Gear: Protocols for wearing safety glasses (critical when prying shattered glass) and working in a well-ventilated area (crucial for adhesive fumes and soldering smoke).
Lighting and Magnification: Recommendations for high-intensity desk lamps and digital microscopes or magnifying visors for viewing microscopic components.
The most physically risky part of mobile repair is opening the device without cracking the glass screen or ripping delicate internal ribbon cables.
Thermal Tools (Heat Guns & Heat Pads): Instructions on setting precise temperatures (typically 80°C to 100°C) to soften heavy factory adhesives without damaging the display.
Suction & Leverage Tools: Proper placement of heavy-duty suction cups and screen prying fixtures to safely create an initial gap.
Separation Media (Plastic Picks & Spudgers): Techniques for slicing through glue lines using plastic opening picks without inserting them too deeply into the frame.
Modern smartphones use dozens of tiny, highly specialized screws and brackets to hold internal shields in place.
Precision Driver Identification: A breakdown of specialized micro-bits, detailing exactly when to use Pentalobe (iPhones), Tri-point/Y-type (internal Apple shields), Torx/Torx Security (Android devices), and standard Micro-Phillips.
Organization Systems: Guidelines for using magnetic project mats or screw organizing trays to map out screw locations, preventing the catastrophic error of “long-screw damage.”
Gripping & Placer Tools: How to utilize straight and curved ESD-safe tweezers to safely disconnect fragile ZIF (Zero Insertion Force) and coaxial cable connectors.
This section transitions the user from basic mechanical teardowns to logical troubleshooting when a phone won’t turn on or charge.
Digital Multimeter (DMM): Step-by-step instructions on setting up the meter for DC voltage testing (checking battery and charging port output) and continuity/diode mode (hunting for short circuits).
DC Power Supply: How to boot a phone motherboard without a battery attached, interpreting current draw (Amperage) to diagnose power management failures.
USB Ammeter / Tester: Utilizing an inline USB safety tester plugged into the charging block to instantly diagnose if a phone is pulling normal current ($1A$ to $2A$) or completely dead ($0A$).
For advanced users handling board-level fixes like swapping out charging ports, audio IC chips, or FPC connectors.
Soldering Iron Stations: Temperature calibration tips, tip selection (chisel vs. conical), and maintenance/tinning procedures.
Hot Air Rework Stations: Managing the delicate balance of air flow and temperature to safely desolder multi-pin components without blowing adjacent surface-mount resistors off the board.
Chemical Consumables: Proper application of rosin flux (to clean joints and fluidize solder), solder wick (braided wire to remove old solder), and low-melt solder alloys.
The final step is cleaning up the internal cavity and sealing the device back up to its original structural integrity.
Chemical Cleaners: Safe usage of 99% Isopropyl Alcohol (IPA) to dissolve old glue residues, flux oils, and clean mild liquid damage.
Liquid Adhesives vs. Tape: Instructions on applying specialized acrylic glues (like B-7000) versus applying precision-cut double-sided adhesive gaskets.
Camping and Curing: Utilizing specialized display repair clamps to apply even, steady pressure while the new adhesives cure over 15 to 30 minutes.
The FORWARD I Master 2 Thermal Infrared Imager Zoom Camera is designed to deliver precision and clarity in thermal imaging, perfect for professionals who demand top-tier performance. With cutting-edge technology, this camera ensures accurate detection and visualization of heat signatures, making it an essential tool for various applications.
This thermal imager is equipped with an advanced zoom feature that provides detailed imaging, even in challenging environments. Its versatility caters to multiple industries including building inspection, thermography, wildlife observation, and equipment diagnostics. Experience effortless exploration and actionable insights.
The FORWARD I Master 2 is crafted with durability and user-friendly operation in mind. Lightweight yet robust, it is portable and built for consistent use in demanding field conditions. Take advantage of intuitive controls that make thermal imaging simple and effective, without compromising on quality.
The FORWARD i Master 2 addresses the critical limitation of standard, fixed-focus thermal sensors: loss of resolution at extreme macro depths. By integrating an ultra-sensitive Vanadium Oxide (VOx) microbolometer array with proprietary AI upscaling and adaptive dampening alignment hardware, it acts as a real-time thermal micro-analyzer.
Technicians can overlay its thermal matrix directly over live microscope feeds or monitor standalone component states on Windows platforms, tracing current leakage down to individual surface-mount diodes (SMDs) and micro-traces.
The following comprehensive breakdown outlines every structural, electrical, optical, and algorithm-based parameter of the FORWARD i Master 2 hardware and software environment.
Standard thermal systems cannot focus closely enough to separate a hot capacitor from an adjacent resistor sharing the same copper pour. The hand-adjusted macro lens of the i Master 2 shifts the focal point down to just $3\text{ cm}$. This micro-focus capability eliminates blur, concentrating the geometric resolution on sub-millimeter nodes on multilayer circuit architectures.
By routing the native $256 \times 192$ pixel array through the embedded software’s AI upscaling filters, it synthesizes an artificial $512 \times 384$ thermal matrix. It uses spatial filtering algorithms to accurately estimate temperature trends across adjacent pixels without adding input lag or dropping frames during live adjustments under a soldering iron.
The damping articulation system is designed to allow the imager to sit side-by-side with high-magnification optical microscopes. By outputting structural data symmetrically, operators can reference optical views and thermal overlays simultaneously, streamlining complex micro-soldering tasks.
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