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2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife

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Original price was: ₹500.Current price is: ₹199.

2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife Precision Designed for Professional Results The 2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade is an essential tool for technicians and professionals working in phone IC glue removal, chip layer lifting, and solder pad maintenance. … Continue reading 2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife

Similar products: "2UUL DA28 Flatcut-Solder Pad Underfill Glue Fast Removal Blade Phone IC Glue Removal Chip Layer Lifting Layer Separation Knife"

-47%

WLXY Precision Knife Set

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Original price was: ₹150.Current price is: ₹80.
-29%

XSoldering 110-220V 200W Lead-free Precision Soldering Station With / Without Soldering Tip

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Original price was: ₹7,000.Current price is: ₹4,999.
-51%

XUAN HOU 0.02mm Gold Cutting Wire

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Original price was: ₹200.Current price is: ₹99.
-40%

XUPCN Micro Shear Flush Cutter

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Original price was: ₹500.Current price is: ₹300.
-51%

YCS 10CC Black Chip Sealing Glue

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Original price was: ₹400.Current price is: ₹198.
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